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NLSX0102FC2T2G

Onsemi

NLSX0102FC2T2G by Onsemi

NLSX0102FC2T2G by Onsemi is a bus driver & transceiver with 2 bits, operating at 3.3V. It features open-drain output characteristics, propagation delay of 255ns, and bidirectional count direction. Ideal for industrial applications requiring translation b/w 1.5/5.5V levels in compact designs with a thin profile package style.

Median Price

$0.769

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,390 parts In-Stock

1+ parts

$0.769

100+ parts

$0.483

1k+ parts

$0.406

10k+ parts

-

1,390

$0.769

$0.483

$0.406

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Element14

Singapore . 1,593 parts In-Stock

1+ parts

$0.895

100+ parts

$0.863

1k+ parts

$0.826

10k+ parts

-

1,593

$0.895

$0.863

$0.826

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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$0.340

3,000

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$0.340

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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3,000

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Distributors (In-Stock)

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Vyrian

USA . 1,535 parts In-Stock

1+ parts

$0.340

100+ parts

-

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1,535

$0.340

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Digiode

USA . 1,707 parts In-Stock

1+ parts

$0.476

100+ parts

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1,707

$0.476

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Corohmni

South Africa . 348 parts In-Stock

1+ parts

$0.340

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-

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348

$0.340

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Corphita

USA . 893 parts In-Stock

1+ parts

$0.451

100+ parts

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893

$0.451

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Continental Prestige Electronics

USA . 2,643 parts In-Stock

1+ parts

$0.674

100+ parts

$0.441

1k+ parts

$0.413

10k+ parts

$0.387

2,643

$0.674

$0.441

$0.413

$0.387

Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.890

100+ parts

-

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500

$0.890

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SupplyDigital Components

Austria . 7,548 parts In-Stock

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Problanco Electronics

Mexico . 6,833 parts In-Stock

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6,833

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TANS Electronics

Latvia . 6,184 parts In-Stock

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Kulean Microsystems

USA . 5,500 parts In-Stock

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Component Stockers USA

USA . 2,369 parts In-Stock

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2,369

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Microchip USA

USA . 1,270 parts In-Stock

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1,270

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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799

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Overview

Elevate your electronic designs with the NLSX0102FC2T2G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As a Bus Driver & Transceiver, this product offers seamless translation capabilities with a wide range of applications. With a nominal supply voltage of 3.3V and a compact package style, this device delivers unmatched performance in a variety of industrial settings. Experience fast propagation delays and open-drain output characteristics, making it an essential component for your projects. Trust Onsemi to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving time during assembly.

Package Shape: RECTANGULAR

A common shape that fits well in various electronic devices and allows for efficient use of space.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a wide range of standard supply voltages, making it versatile for different applications.

Propagation Delay (tpd): 255 ns

Provides fast signal transmission, ensuring efficient communication within the bus system.

Output Characteristics: OPEN-DRAIN

Allows for easy interfacing with other components and devices, enhancing the overall functionality of the bus driver.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and performance under challenging conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it a reliable choice for bus driver applications.

Technical Specifications

Bus Driver & Transceivers NLSX0102FC2T2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Length:

1.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay (tpd):

255 ns

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/5.5V & 1.5/5.5V

Width:

.9 mm

Trade Compliance

NLSX0102FC2T2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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