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NLSX3018DTR2G

Onsemi

NLSX3018DTR2G by Onsemi

NLSX3018DTR2G by Onsemi is a 4-bit bus driver with 3-STATE output, operating at a supply voltage range of 1.3V to 4.5V. It features a propagation delay of 9.3ns and can withstand temperatures from -40°C to 85°C, making it suitable for industrial applications requiring fast signal transmission in compact spaces. This small outline package with dual terminals and shrink pitch is ideal for surface-mount designs where space is limited.

Median Price

$1.468

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 674 parts In-Stock

1+ parts

$0.997

100+ parts

$0.937

1k+ parts

$0.847

10k+ parts

-

674

$0.997

$0.937

$0.847

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DigiKey

USA . 1,409 parts In-Stock

1+ parts

$1.940

100+ parts

$1.315

1k+ parts

$0.888

10k+ parts

-

1,409

$1.940

$1.315

$0.888

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 4,334 parts In-Stock

1+ parts

$0.590

100+ parts

-

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4,334

$0.590

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Digiode

USA . 2,343 parts In-Stock

1+ parts

$0.947

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2,343

$0.947

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$1.920

100+ parts

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600

$1.920

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Vyrian

USA . 3,422 parts In-Stock

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3,422

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Distributors (Availability)

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Ampacity Inc.

Singapore . 756 parts In-Stock

1+ parts

$0.850

100+ parts

-

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756

$0.850

-

-

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Corphita

USA . 2,068 parts In-Stock

1+ parts

$0.897

100+ parts

-

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10k+ parts

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2,068

$0.897

-

-

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Component Stockers USA

USA . 1,958 parts In-Stock

1+ parts

$0.990

100+ parts

$0.930

1k+ parts

$0.880

10k+ parts

-

1,958

$0.990

$0.930

$0.880

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$0.997

100+ parts

-

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89

$0.997

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Continental Prestige Electronics

USA . 1,909 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

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10k+ parts

$1.882

1,909

$1.920

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-

$1.882

Argo Parts USA

USA . 1,092 parts In-Stock

1+ parts

$1.920

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1,092

$1.920

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Vigor

Singapore . 467 parts In-Stock

1+ parts

$2.040

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467

$2.040

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Microchip USA

USA . 4,727 parts In-Stock

1+ parts

$6.136

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4,727

$6.136

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Aztec Data Supply Inc.

USA . 3,518 parts In-Stock

1+ parts

$13.048

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3,518

$13.048

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Perfect Parts

USA . 60,997 parts In-Stock

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60,997

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Lixinc

USA . 17,180 parts In-Stock

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17,180

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 6,925 parts In-Stock

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6,925

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SupplyDigital Components

Austria . 2,632 parts In-Stock

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2,632

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Kulean Microsystems

USA . 2,388 parts In-Stock

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Kepictronics

USA . 1,175 parts In-Stock

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Problanco Electronics

Mexico . 940 parts In-Stock

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Futuretech Components

Singapore . 542 parts In-Stock

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542

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UHIMA Technologies

Türkiye . 434 parts In-Stock

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434

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Overview

Unlock seamless communication with the NLSX3018DTR2G by Onsemi, a cutting-edge bus driver & transceiver. Crafted with precision and innovation, this small outline, thin profile device offers lightning-fast 9.3 ns propagation delay, ensuring reliable data transmission. Perfect for industrial applications, this product boasts a wide operating temperature range (-40 to 85 °C) and true output polarity. Elevate your projects with the quality and performance that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and enabling high density designs.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V makes the product compatible with a wide range of systems and applications.

Propagation Delay (tpd): 9.3 ns

With a low propagation delay of 9.3 ns, the product ensures fast and efficient data transmission, making it ideal for high-speed communication.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions, ensuring reliability in various settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can still function effectively in extremely cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides excellent conductivity and corrosion resistance, increasing the longevity and reliability of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate in rugged environments with varying temperature conditions, making it a versatile and durable choice.

Technical Specifications

Bus Driver & Transceivers NLSX3018DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

3018

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLSX3018DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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