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NLSX3014MUTAG

Onsemi

NLSX3014MUTAG by Onsemi

NLSX3014MUTAG by Onsemi is a 4-bit bus driver with 3-STATE output, operating at a supply voltage range of 1.3V to 4.5V. With a propagation delay of 17ns, it is suitable for industrial applications requiring fast signal transmission in compact spaces due to its very thin profile chip carrier package measuring 2mm x 1.7mm and terminal pitch of 0.4mm.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,300 parts In-Stock

1+ parts

$2.220

100+ parts

$1.339

1k+ parts

$1.181

10k+ parts

$1.100

7,300

$2.220

$1.339

$1.181

$1.100

Rochester

USA . 4,945 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

4,945

-

$1.400

$1.160

$1.040

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.300

3,000

-

-

$1.450

$1.300

Flip Electronics (Authorized)

USA . 2,711 parts In-Stock

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-

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2,711

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-

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Distributors (In-Stock)

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Digiode

USA . 1,578 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

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1,578

$1.092

-

-

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Vyrian

USA . 2,490 parts In-Stock

1+ parts

$1.150

100+ parts

-

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-

10k+ parts

-

2,490

$1.150

-

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Flip Electronics

USA . 4,329 parts In-Stock

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4,329

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Velocity Electronics

USA . 10 parts In-Stock

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10

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,129 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

$1.035

-

-

-

Corohmni

South Africa . 427 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

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427

$1.150

-

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QUARKTWIN TECHNOLOGY LTD

USA . 22,272 parts In-Stock

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22,272

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Perfect Parts

USA . 16,417 parts In-Stock

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16,417

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TANS Electronics

Latvia . 7,889 parts In-Stock

1+ parts

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7,889

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 5,406 parts In-Stock

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5,406

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Kulean Microsystems

USA . 5,040 parts In-Stock

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5,040

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SupplyDigital Components

Austria . 3,634 parts In-Stock

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3,634

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 1,682 parts In-Stock

1+ parts

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1,682

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Metaverse IC Inc.

Canada . 424 parts In-Stock

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424

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Microchip USA

USA . 406 parts In-Stock

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406

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UHIMA Technologies

Türkiye . 400 parts In-Stock

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400

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Discover the NLSX3014MUTAG by Onsemi, a top-of-the-line bus driver & transceiver that offers unparalleled quality and reliability. With a sleek rectangular package shape and very thin profile chip carrier design, this 4-bit device is perfect for a wide range of applications. From industrial automation to telecommunications, this versatile component operates at a nominal supply voltage of 3.3V and provides a fast propagation delay of just 17ns. Trust in Onsemi's reputation for excellence and choose the NLSX3014MUTAG for your next project to experience superior performance and efficiency like never before.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

No. of Bits: 4

Provides sufficient data handling capacity for efficient communication in bus driver applications.

Nominal Supply Voltage: 3.3V

Compatible with common digital logic levels, making it versatile for various applications.

Propagation Delay (tpd): 17 ns

Offers fast signal propagation, essential for high-speed communication and data transfer.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of environmental conditions, suitable for industrial settings.

Terminal Pitch: 0.4 mm

Allows for fine pitch connections, enabling high density mounting on PCBs for space-saving designs.

Technical Specifications

Bus Driver & Transceivers NLSX3014MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

3014

JESD-30 Code:

R-XQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.7 mm

Trade Compliance

NLSX3014MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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