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NLSX4373DMR2G

Onsemi

NLSX4373DMR2G by Onsemi

NLSX4373DMR2G by Onsemi is a bus driver & transceiver with 20ns propagation delay, suitable for industrial applications. It features 2 functions, open-drain output characteristics, and operates at a temperature range of -40 to 85 °C. With a small outline package style and dual terminal position, it offers bidirectional control with low enable input.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

$0.747

100+ parts

$0.702

1k+ parts

$0.635

10k+ parts

-

12,000

$0.747

$0.702

$0.635

-

DigiKey

USA . 4,648 parts In-Stock

1+ parts

$1.450

100+ parts

$0.852

1k+ parts

$0.744

10k+ parts

$0.640

4,648

$1.450

$0.852

$0.744

$0.640

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$4.760

100+ parts

-

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1

$4.760

-

-

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Flip Electronics (Authorized)

USA . 12,123 parts In-Stock

1+ parts

-

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12,123

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Distributors (In-Stock)

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Digiode

USA . 764 parts In-Stock

1+ parts

$0.709

100+ parts

-

1k+ parts

-

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764

$0.709

-

-

-

Vyrian

USA . 2,057 parts In-Stock

1+ parts

$0.747

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$0.747

-

-

-

Flip Electronics

USA . 12,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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12,123

-

-

-

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Cyclops Electronics Ltd

UK . 8,200 parts In-Stock

1+ parts

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8,200

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Semtec, LLC

USA . 98 parts In-Stock

1+ parts

-

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98

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,782 parts In-Stock

1+ parts

$0.672

100+ parts

-

1k+ parts

-

10k+ parts

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1,782

$0.672

-

-

-

Corohmni

South Africa . 97 parts In-Stock

1+ parts

$0.747

100+ parts

-

1k+ parts

-

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97

$0.747

-

-

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Vigor

Singapore . 199 parts In-Stock

1+ parts

$1.470

100+ parts

-

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199

$1.470

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-

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Microchip USA

USA . 1,166 parts In-Stock

1+ parts

$10.400

100+ parts

-

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1,166

$10.400

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TANS Electronics

Latvia . 7,414 parts In-Stock

1+ parts

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7,414

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Perfect Parts

USA . 7,368 parts In-Stock

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7,368

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SupplyDigital Components

Austria . 7,167 parts In-Stock

1+ parts

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7,167

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Kulean Microsystems

USA . 6,604 parts In-Stock

1+ parts

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6,604

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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145

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Problanco Electronics

Mexico . 140 parts In-Stock

1+ parts

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140

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Overview

Upgrade your electronic systems with the NLSX4373DMR2G by Onsemi, a top-of-the-line bus driver and transceiver that combines quality and reliability. With a small outline, thin profile package and dual terminals, this product offers seamless integration into various applications. Benefit from its 2 functions, true output polarity, and open-drain characteristics for efficient operation. With a wide operating temperature range and advanced CMOS technology, this industrial-grade device guarantees superior performance in demanding environments. Trust Onsemi's expertise in semiconductor manufacturing and unlock the potential of your projects with the NLSX4373DMR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use, making the product resistant to wear and tear.

Propagation Delay At Nominal Supply: 20 ns

Fast propagation delay ensures quick data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.8

Optimal supply voltage ensures stable performance and efficient power consumption.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for flexibility in connecting to different types of devices, enhancing compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers NLSX4373DMR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

4000/14000/40000

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

1000 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NLSX4373DMR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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