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NL37WZ14USG

Onsemi

NL37WZ14USG by Onsemi

NL37WZ14USG by Onsemi is a CMOS Logic Gate with 3 functions, 7.5 ns propagation delay at 2.5V, and 15 pF load capacitance. Ideal for military applications due to its MILITARY temperature grade, it operates b/w -55 to 125 °C and has a small outline package style.

Median Price

$0.164

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 21,863 parts In-Stock

1+ parts

$0.230

100+ parts

$0.121

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$0.100

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21,863

$0.230

$0.121

$0.100

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Farnell

UK . 265,990 parts In-Stock

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Rochester

USA . 88,988 parts In-Stock

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$0.210

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$0.174

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$0.155

88,988

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$0.210

$0.174

$0.155

Verical

USA . 51,903 parts In-Stock

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$0.194

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$0.194

DigiKey

USA . 51,758 parts In-Stock

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$0.091

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$0.091

Avnet

USA . 15,000 parts In-Stock

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Element14

Singapore . 3,120 parts In-Stock

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Arrow

USA . 3,000 parts In-Stock

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$0.134

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$0.134

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.119

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$0.099

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$0.093

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$0.119

$0.099

$0.093

Distributors (In-Stock)

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Digiode

USA . 1,936 parts In-Stock

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$0.084

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Nova Conductors

Japan . 50 parts In-Stock

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$0.167

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DigiKey Marketplace

USA . 387,503 parts In-Stock

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Chip Stock

USA . 7,500 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.349

Vyrian

USA . 5,243 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,140 parts In-Stock

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Semi Source

USA . 113 parts In-Stock

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NexGen Digital

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Corohmni

South Africa . 219 parts In-Stock

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$0.074

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$0.074

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Corphita

USA . 1,020 parts In-Stock

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$0.079

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Continental Prestige Electronics

USA . 405,424 parts In-Stock

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$0.094

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Ampacity Inc.

Singapore . 88,011 parts In-Stock

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$0.163

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Argo Parts USA

USA . 470 parts In-Stock

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$0.167

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$0.162

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Vigor

Singapore . 752 parts In-Stock

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$0.430

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Microchip USA

USA . 118 parts In-Stock

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$1.058

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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Perfect Parts

USA . 82,594 parts In-Stock

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Lixinc

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Kepictronics

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Problanco Electronics

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iodParts Technologies Inc.

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TANS Electronics

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 943 parts In-Stock

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Futuretech Components

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Kulean Microsystems

USA . 522 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.164

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$0.159

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$0.156

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$0.156

Overview

Unlock the power of precision with the NL37WZ14USG logic gates by Onsemi. Crafted with top-notch quality and backed by a reputable manufacturer, these logic gates offer unparalleled performance and reliability. From military-grade applications to everyday electronics, this product delivers exceptional value, efficiency, and versatility. Elevate your projects with the NL37WZ14USG and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast signal processing and efficient operation.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 2.5

Low nominal supply voltage helps in reducing power consumption and operating costs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and reliability in various environments.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures make this product suitable for extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice.

Technical Specifications

Logic Gates NL37WZ14USG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

37WZ

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NL37WZ14USG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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