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NL37WZ07US

Onsemi

NL37WZ07US by Onsemi

NL37WZ07US by Onsemi is a logic gate with 3 functions, featuring a propagation delay of 4.8 ns and operating temperature range from -40 to 85 °C. This CMOS technology device has a supply voltage of 1.8V to 5.5V, making it suitable for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 278,545 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

278,545

-

$0.159

$0.132

$0.117

DigiKey

USA . 278,545 parts In-Stock

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$0.200

278,545

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$0.200

Verical

USA . 216,000 parts In-Stock

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$0.147

216,000

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$0.147

Distributors (In-Stock)

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Digiode

USA . 1,121 parts In-Stock

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$0.130

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1,121

$0.130

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Vyrian

USA . 1,814 parts In-Stock

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$0.137

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$0.137

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PC Components Company LLC

USA . 5,179 parts In-Stock

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5,179

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Bristol Electronics

USA . 5,179 parts In-Stock

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5,179

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Distributors (Availability)

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Corphita

USA . 280 parts In-Stock

1+ parts

$0.123

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280

$0.123

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Component Stockers USA

USA . 244,344 parts In-Stock

1+ parts

$0.130

100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.110

244,344

$0.130

$0.120

$0.110

$0.110

Corohmni

South Africa . 369 parts In-Stock

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$0.137

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369

$0.137

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Continental Prestige Electronics

USA . 278,845 parts In-Stock

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$0.109

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278,845

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Problanco Electronics

Mexico . 6,457 parts In-Stock

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TANS Electronics

Latvia . 6,023 parts In-Stock

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Assy Fe

Spain . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 3,323 parts In-Stock

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Kulean Microsystems

USA . 3,291 parts In-Stock

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Perfect Parts

USA . 3,098 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 242 parts In-Stock

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Vigor

Singapore . 228 parts In-Stock

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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Overview

Enhance your electronic projects with the NL37WZ07US by Onsemi. Known for their high-quality components, Onsemi delivers reliable logic gates that are essential for a wide range of applications. Whether you're working on consumer electronics or industrial automation, this product offers unparalleled value with its fast propagation delay and low power consumption. Upgrade your designs with Onsemi's innovative technology and trust in their reputation for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for surface mounting applications.

Propagation Delay At Nominal Supply: 4.8 ns

The low propagation delay ensures fast signal processing and reduces latency in the system.

No. of Functions: 3

Having multiple functions in a single component saves space on the circuit board and simplifies the design.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage of 1.8V, making it suitable for low power applications.

Maximum I (ol): 24 Amp

Capable of driving high current loads, providing versatility in different circuit configurations.

Output Characteristics: OPEN-DRAIN

The open-drain output design allows for easy interfacing with other components and devices in the system.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, contributing to overall system efficiency.

Technical Specifications

Logic Gates NL37WZ07US attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

37WZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NL37WZ07US Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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