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NL37WZ04US

Onsemi

NL37WZ04US by Onsemi

NL37WZ04US by Onsemi is a CMOS Logic Gate with 3 functions, 5ns propagation delay at 1.8V. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 5.5V. Ideal for applications requiring fast signal processing in compact designs.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119,751 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

119,751

-

$0.159

$0.132

$0.117

DigiKey

USA . 119,751 parts In-Stock

1+ parts

-

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$0.200

119,751

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$0.200

Verical

USA . 69,000 parts In-Stock

1+ parts

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$0.147

69,000

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$0.147

Distributors (In-Stock)

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Vyrian

USA . 1,933 parts In-Stock

1+ parts

$0.109

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1,933

$0.109

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Digiode

USA . 788 parts In-Stock

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$0.124

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788

$0.124

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Mil-Aero Solutions, Inc.

USA . 3,000 parts In-Stock

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3,000

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North Shore Components

USA . 32 parts In-Stock

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NPI Materials, Inc.

USA . 12 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$0.109

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108

$0.109

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Corphita

USA . 2,362 parts In-Stock

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$0.117

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2,362

$0.117

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Component Stockers USA

USA . 90,783 parts In-Stock

1+ parts

$0.130

100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.110

90,783

$0.130

$0.120

$0.110

$0.110

Continental Prestige Electronics

USA . 119,751 parts In-Stock

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$0.109

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119,751

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$0.109

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TANS Electronics

Latvia . 6,864 parts In-Stock

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SupplyDigital Components

Austria . 6,426 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Kulean Microsystems

USA . 3,255 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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2,800

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Assy Fe

Spain . 2,710 parts In-Stock

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2,710

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Problanco Electronics

Mexico . 2,175 parts In-Stock

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Vigor

Singapore . 499 parts In-Stock

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499

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UHIMA Technologies

Türkiye . 17 parts In-Stock

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Overview

Discover the power of precision with the NL37WZ04US by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The NL37WZ04US falls under the Logic Gates category, offering three functions in one compact package. From its fast propagation delay to its low power consumption, this product is designed to exceed expectations. Whether you're working on industrial automation or consumer electronics, this logic gate is the perfect solution for your circuit design needs. Upgrade your projects with the NL37WZ04US and experience unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 5 ns

With a fast propagation delay of 5ns at nominal supply voltage, this logic gate ensures quick signal processing, suitable for high-speed applications.

Surface Mount: YES

Being surface mount allows for easy and convenient installation on circuit boards, saving space and enhancing overall circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V, this logic gate consumes less power, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this logic gate can withstand elevated temperatures, suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it reliable for various digital applications.

Technical Specifications

Logic Gates NL37WZ04US attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

37WZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NL37WZ04US Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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