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NL37WZ06US

Onsemi

NL37WZ06US by Onsemi

NL37WZ06US by Onsemi is a logic gate with 3.7ns propagation delay, suitable for applications requiring fast signal processing. Operating at 1.8V to 5.5V, it features open-drain output and can handle up to 24A current, making it ideal for military-grade electronics in harsh environments. The small outline package with dual terminals and tin-lead finish ensures easy integration into compact circuit designs.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,778 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

8,778

-

$0.159

$0.132

$0.117

DigiKey

USA . 8,778 parts In-Stock

1+ parts

-

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$0.200

8,778

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$0.200

Verical

USA . 6,000 parts In-Stock

1+ parts

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$0.147

6,000

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$0.147

Distributors (In-Stock)

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Digiode

USA . 1,359 parts In-Stock

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$0.124

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1,359

$0.124

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Chip Stock

USA . 74,000 parts In-Stock

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Vyrian

USA . 12,157 parts In-Stock

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R&J Components

USA . 267 parts In-Stock

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267

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Distributors (Availability)

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Corphita

USA . 551 parts In-Stock

1+ parts

$0.117

100+ parts

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551

$0.117

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Vigor

Singapore . 865 parts In-Stock

1+ parts

$0.120

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865

$0.120

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Corohmni

South Africa . 135 parts In-Stock

1+ parts

$0.130

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135

$0.130

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Benley Electronics

USA . 2 parts In-Stock

1+ parts

$1.750

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2

$1.750

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$13.930

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477

$13.930

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,967 parts In-Stock

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Continental Prestige Electronics

USA . 8,778 parts In-Stock

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$0.113

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$0.113

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Kulean Microsystems

USA . 6,269 parts In-Stock

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TANS Electronics

Latvia . 4,653 parts In-Stock

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Kepictronics

USA . 3,300 parts In-Stock

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SupplyDigital Components

Austria . 3,289 parts In-Stock

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Assy Fe

Spain . 1,944 parts In-Stock

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Problanco Electronics

Mexico . 1,419 parts In-Stock

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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470

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Microchip USA

USA . 330 parts In-Stock

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330

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Overview

Discover the NL37WZ06US by Onsemi, a high-quality logic gate that offers fast propagation delay and open-drain output characteristics. Manufactured by Onsemi, a trusted name in semiconductor technology, this product is perfect for military-grade applications requiring precise digital signal processing. With a small outline and very thin profile package style, this logic gate provides customers with efficient performance and reliability. Upgrade your projects with the NL37WZ06US and experience seamless integration and superior functionality.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 3.7 ns

Low propagation delay ensures fast response time, making this product suitable for applications requiring quick signal processing.

No. of Functions: 3

Having multiple functions in a single package can help reduce the overall component count in a circuit, saving space and simplifying design.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage can lead to reduced power consumption and heat generation, making this product energy-efficient.

Output Characteristics: OPEN-DRAIN

Open-drain outputs allow for flexible interfacing with other circuitry, making this product versatile in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient in digital applications.

Technical Specifications

Logic Gates NL37WZ06US attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

37WZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NL37WZ06US Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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