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NLV37WZ14USG

Onsemi

NLV37WZ14USG by Onsemi

NLV37WZ14USG by Onsemi is a CMOS Logic Gate with 3 functions, 7.5 ns propagation delay, and 15 pF load capacitance. It operates at a supply voltage of 2.5 V to 5.5 V and is suitable for military-grade applications due to its AEC-Q100 screening level. The package style is small outline with very thin profile, making it ideal for space-constrained designs requiring fast signal processing.

Median Price

$0.118

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,973 parts In-Stock

1+ parts

-

100+ parts

$0.128

1k+ parts

$0.106

10k+ parts

$0.094

25,973

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$0.128

$0.106

$0.094

DigiKey

USA . 25,473 parts In-Stock

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-

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$0.110

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$0.110

Verical

USA . 18,813 parts In-Stock

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$0.118

18,813

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$0.118

Distributors (In-Stock)

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Flip Electronics

USA . 6,000 parts In-Stock

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$0.080

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6,000

$0.080

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Digiode

USA . 2,087 parts In-Stock

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$0.100

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2,087

$0.100

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Vyrian

USA . 1,950 parts In-Stock

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$0.105

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1,950

$0.105

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Distributors (Availability)

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Corphita

USA . 138 parts In-Stock

1+ parts

$0.094

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138

$0.094

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Corohmni

South Africa . 202 parts In-Stock

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$0.105

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202

$0.105

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Vigor

Singapore . 343 parts In-Stock

1+ parts

$0.270

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343

$0.270

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Microchip USA

USA . 7,270 parts In-Stock

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7,270

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Problanco Electronics

Mexico . 5,278 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,906 parts In-Stock

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SupplyDigital Components

Austria . 2,156 parts In-Stock

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TANS Electronics

Latvia . 1,881 parts In-Stock

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Kulean Microsystems

USA . 1,148 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Overview

Discover the next level of efficiency and reliability with the NLV37WZ14USG by Onsemi. Crafted with precision and expertise, this logic gate offers unparalleled performance in various applications. With a compact design and advanced technology, this product provides customers with unmatched value, benefits, and advantages. Trust Onsemi to deliver quality products that exceed expectations and elevate your projects to new heights. Upgrade to the NLV37WZ14USG and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material helps protect the internal components of the logic gates, ensuring a longer lifespan and reliable performance.

Propagation Delay At Nominal Supply: 7.5 ns

Fast propagation delay ensures quick signal processing, making the logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount packaging makes it easy to integrate the logic gates onto circuit boards, saving space and simplifying assembly.

No. of Functions: 3

Having multiple functions in a single package provides versatility and flexibility in designing different electronic circuits.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low supply voltage, making it energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and noise immunity, enhancing the efficiency and reliability of the logic gates.

Technical Specifications

Logic Gates NLV37WZ14USG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

37WZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NLV37WZ14USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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