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NL27WZ14MU3TCG

Onsemi

NL27WZ14MU3TCG by Onsemi

NL27WZ14MU3TCG by Onsemi is a Logic Gates IC with 2 functions, 9.1ns propagation delay, and 15.5ns tpd. Ideal for military-grade applications, it operates b/w -55 to 125 °C and has a Vsup range of 1.65V to 5.5V. This surface-mount device features Schmitt Trigger technology and a small outline package style.

Median Price

$0.201

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 203,450 parts In-Stock

1+ parts

-

100+ parts

$0.201

1k+ parts

$0.167

10k+ parts

$0.148

203,450

-

$0.201

$0.167

$0.148

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 317 parts In-Stock

1+ parts

$0.080

100+ parts

-

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317

$0.080

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Vyrian

USA . 7,671 parts In-Stock

1+ parts

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7,671

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Chip Stock

USA . 804 parts In-Stock

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804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,253 parts In-Stock

1+ parts

$0.076

100+ parts

-

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2,253

$0.076

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Corohmni

South Africa . 460 parts In-Stock

1+ parts

$0.084

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-

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460

$0.084

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Component Stockers USA

USA . 64,066 parts In-Stock

1+ parts

$1.330

100+ parts

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64,066

$1.330

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$15.420

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664

$15.420

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QUARKTWIN TECHNOLOGY LTD

USA . 19,499 parts In-Stock

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19,499

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TANS Electronics

Latvia . 7,307 parts In-Stock

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7,307

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SupplyDigital Components

Austria . 6,037 parts In-Stock

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6,037

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Kulean Microsystems

USA . 5,879 parts In-Stock

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5,879

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Problanco Electronics

Mexico . 1,517 parts In-Stock

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1,517

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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710

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Microchip USA

USA . 344 parts In-Stock

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344

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Overview

Discover the NL27WZ14MU3TCG by Onsemi, a top-quality logic gate that delivers exceptional performance and reliability. With a compact design and versatile applications, this product is the ideal choice for a wide range of electronic projects. Experience fast propagation delay and minimal power consumption, making it a valuable addition to your circuit designs. Trust in Onsemi's reputation for excellence and innovation, and elevate your projects with the NL27WZ14MU3TCG today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 9.1 ns

Low propagation delay ensures fast response times, making this product suitable for applications requiring quick and accurate signal processing.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, leading to a more compact and cost-effective design.

Nominal Supply Voltage / Vsup (V): 2.3

Operates at a moderate supply voltage, making it compatible with a wide range of systems while still providing efficient performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and allows for use in industrial or automotive applications.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold conditions, making this product versatile for various environmental settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for digital circuits.

Technical Specifications

Logic Gates NL27WZ14MU3TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XDSO-N6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

9.1 ns

Propagation Delay (tpd):

15.5 ns

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL27WZ14MU3TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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