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NL17SZ14XV5T2

Onsemi

NL17SZ14XV5T2 by Onsemi

NL17SZ14XV5T2 by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 50pF Load Capacitance, and 1.8V Nominal Voltage. Ideal for industrial applications requiring Schmitt Trigger functionality in a small outline package with dual terminals and tin finish.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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AZTECH Wire

Italy . 558 parts In-Stock

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Component Stockers USA

USA . 281 parts In-Stock

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Kepictronics

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SupplyDigital Components

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Problanco Electronics

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Corphita

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Kulean Microsystems

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Corohmni

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Microchip USA

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TANS Electronics

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UHIMA Technologies

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Overview

Unlock the power of efficient logic gates with the NL17SZ14XV5T2 by Onsemi. Crafted with precision and reliability, this small outline, very thin profile package offers a fast propagation delay of 7.5 ns, making it perfect for industrial applications where speed is crucial. With a nominal supply voltage of 1.8V and a maximum supply voltage of 5.5V, this logic gate provides versatile solutions to meet your circuit needs. Experience seamless performance and exceptional quality with Onsemi's innovative technology. Elevate your designs with the NL17SZ14XV5T2 and unleash the potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while keeping it cost-effective.

Propagation Delay At Nominal Supply: 7.5 ns

Fast propagation delay ensures quick response times in processing signals, making this product efficient for time-sensitive operations.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto circuit boards, reducing assembly time and costs.

Package Shape: RECTANGULAR

Rectangular shape saves space and allows for dense packing on PCBs, optimizing the use of available real estate on the board.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage helps in reducing power consumption and heat generation, making the product energy efficient.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable and reliable performance with minimal signal distortion, enhancing the overall functionality of the product.

Power Supplies (V): 3.3

Operational at a common power supply voltage of 3.3V, this product can be easily integrated into existing systems without the need for additional power sources.

Maximum I (ol): 24 Amp

High output current capability allows for driving heavy loads or multiple devices, enhancing the versatility and flexibility of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability and functionality in various environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capability to operate in extreme cold temperatures ensures the product's reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product reliable and efficient for digital logic operations.

Technical Specifications

Logic Gates NL17SZ14XV5T2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SZ14XV5T2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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