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NL17SZ00P5T5G-L22088

Onsemi

NL17SZ00P5T5G-L22088 by Onsemi

NL17SZ00P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 2 inputs, 5 terminals, and propagation delay of 5.2 ns at 5V. It operates in temperatures ranging from -55 to 125 °C and has a load capacitance of 50 pF. Ideal for military-grade applications due to its small outline package style and low power supply current requirements.

Median Price

$0.077

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.077

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900

$0.077

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Vyrian

USA . 8,300 parts In-Stock

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8,300

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Digiode

USA . 2,388 parts In-Stock

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2,388

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Distributors (Availability)

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$0.074

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289

$0.074

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Argo Parts USA

USA . 1,130 parts In-Stock

1+ parts

$0.077

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$0.075

1,130

$0.077

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-

$0.075

Continental Prestige Electronics

USA . 275 parts In-Stock

1+ parts

$0.077

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$0.075

275

$0.077

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$0.075

Microchip USA

USA . 9,862 parts In-Stock

1+ parts

$0.390

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9,862

$0.390

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AZTECH Wire

Italy . 437 parts In-Stock

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$8.868

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437

$8.868

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Aztec Data Supply Inc.

USA . 524 parts In-Stock

1+ parts

$20.630

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524

$20.630

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Ampacity Inc.

Singapore . 178 parts In-Stock

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$31.000

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178

$31.000

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Semicontronic

India . 296 parts In-Stock

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$64.000

100+ parts

$62.400

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$62.080

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296

$64.000

$62.400

$62.080

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Kulean Microsystems

USA . 6,888 parts In-Stock

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Problanco Electronics

Mexico . 3,045 parts In-Stock

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SupplyDigital Components

Austria . 3,023 parts In-Stock

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TANS Electronics

Latvia . 2,797 parts In-Stock

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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Corphita

USA . 465 parts In-Stock

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465

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Netroflash

USA . 50 parts In-Stock

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$0.075

1k+ parts

$0.073

10k+ parts

$0.072

50

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$0.075

$0.073

$0.072

Overview

Enhance your electronic projects with the NL17SZ00P5T5G-L22088 logic gate by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers reliable components that meet stringent industry standards. Ideal for applications requiring fast signal processing, this logic gate offers a quick propagation delay of 5.2 ns and a low power supply current of 0.01 mA. Whether you're designing circuits for consumer electronics or aerospace systems, the NL17SZ00P5T5G-L22088 provides exceptional performance and efficiency. Upgrade your designs today with this compact and versatile logic gate from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 5.2 ns

With a low propagation delay, this product ensures fast and efficient signal processing in electronic circuits.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

No. of Inputs: 2

With 2 inputs, this logic gate offers versatility in circuit design and operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of PCB space.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage, this product is compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures stable performance in high-frequency applications.

Power Supplies (V): 3.3V

The ability to operate at a lower 3.3V supply voltage offers energy efficiency and compatibility with low-power systems.

No. of Terminals: 5

With 5 terminals, this logic gate provides ample connection options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile design make this product suitable for compact electronic devices with limited space.

Maximum I (ol): 24 Amp

The high maximum output current of 24 Amp allows for driving heavy loads in the circuit.

Propagation Delay (tpd): 12 ns

With a propagation delay of 12 ns, this product ensures quick response times in signal processing.

Maximum Operating Temperature: 125 °C

Operating at temperatures up to 125°C, this logic gate is suitable for harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this product suitable for a wide range of environments.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and installation options.

Maximum Seated Height: 0.4 mm

The low maximum seated height of 0.4 mm ensures minimal space requirement on the PCB.

Width: 0.8 mm

The narrow width of 0.8 mm allows for efficient space utilization on the PCB.

Minimum Supply Voltage (Vsup): 1.65V

With a low minimum supply voltage of 1.65V, this product is compatible with low-power applications.

Length: 1 mm

The compact length of 1 mm makes this logic gate suitable for space-constrained electronic designs.

Temperature Grade: MILITARY

Designed for military-grade performance, this product offers reliable operation in extreme conditions.

Technology: CMOS

The CMOS technology used in this logic gate ensures low power consumption and high-speed operation.

Terminal Form: FLAT

The flat terminal form ensures easy assembly and soldering on the PCB.

Packing Method: TR

The TR packing method provides convenient handling and storage of the product.

Terminal Pitch: 0.35 mm

The small terminal pitch of 0.35 mm allows for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this product offers compatibility with a wide range of electronic systems.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current of 0.01 mA ensures energy efficiency and minimal power consumption.

Technical Specifications

Logic Gates NL17SZ00P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

NL17SZ00P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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