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NL17SG34P5T5G

Onsemi

NL17SG34P5T5G by Onsemi

NL17SG34P5T5G by Onsemi is a CMOS Logic Gate with 4.8ns Propagation Delay, suitable for military applications. It operates at 1.1V nominal voltage and can handle load capacitance of 30pF. With a small outline package style, it is designed for surface mount assembly in compact electronic devices.

Median Price

$0.058

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 349,000 parts In-Stock

1+ parts

-

100+ parts

$0.058

1k+ parts

$0.048

10k+ parts

$0.043

349,000

-

$0.058

$0.048

$0.043

Farnell

UK . 349,000 parts In-Stock

1+ parts

-

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$0.137

349,000

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$0.137

Verical

USA . 120,000 parts In-Stock

1+ parts

-

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$0.053

120,000

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$0.053

Distributors (In-Stock)

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Digiode

USA . 268 parts In-Stock

1+ parts

$0.045

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268

$0.045

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Flip Electronics

USA . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 6,525 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 348,847 parts In-Stock

1+ parts

$0.040

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-

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348,847

$0.040

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Corphita

USA . 1,209 parts In-Stock

1+ parts

$0.042

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1,209

$0.042

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Corohmni

South Africa . 311 parts In-Stock

1+ parts

$0.047

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311

$0.047

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Vigor

Singapore . 936 parts In-Stock

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$0.100

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936

$0.100

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AZTECH Wire

Italy . 253 parts In-Stock

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$9.460

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253

$9.460

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Aztec Data Supply Inc.

USA . 262 parts In-Stock

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$26.290

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262

$26.290

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Continental Prestige Electronics

USA . 349,000 parts In-Stock

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$0.137

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349,000

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$0.137

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A-Z Elektronik GmbH

Germany . 5,592 parts In-Stock

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5,592

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Problanco Electronics

Mexico . 4,604 parts In-Stock

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Argo Parts USA

USA . 4,303 parts In-Stock

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Kulean Microsystems

USA . 3,431 parts In-Stock

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Microchip USA

USA . 2,561 parts In-Stock

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TANS Electronics

Latvia . 1,609 parts In-Stock

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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SupplyDigital Components

Austria . 202 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the next level of performance with the NL17SG34P5T5G by Onsemi. Crafted with precision and expertise, this logic gate offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this product guarantees seamless functionality and superior quality. Unlock endless possibilities with Onsemi's cutting-edge technology and elevate your projects to new heights. Discover the value and benefits that the NL17SG34P5T5G brings to your work, and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4.8 ns

The low propagation delay allows for fast signal processing, making these logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 1.1

Operating at a low nominal supply voltage conserves power and reduces heat generation, making these logic gates energy-efficient.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures compatibility with a wide range of external components, allowing for versatile circuit design.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages enhances flexibility in circuit design and compatibility with existing systems.

Maximum I (ol): 8 Amp

The high maximum output current capability allows these logic gates to drive heavy loads, making them suitable for demanding applications.

Minimum Operating Temperature: -55 °C

With a wide temperature range, these logic gates can operate reliably in harsh environments and extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making these logic gates versatile and efficient.

Technical Specifications

Logic Gates NL17SG34P5T5G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVP

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

22.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

4.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.8 mm

Trade Compliance

NL17SG34P5T5G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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