Loading...

NIS5101E2T1G

Onsemi

NIS5101E2T1G by Onsemi

NIS5101E2T1G by Onsemi is a Power Management IC with 48V Vsup, 7 terminals, and GULL WING terminal form. It is used in POWER SUPPLY SUPPORT CIRCUIT applications due to its small outline package style and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,500

-

-

-

-

Sea View Technologies

USA . 7,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,791

-

-

-

-

Vyrian

USA . 3,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

-

-

-

-

Digiode

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,081

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,819

-

-

-

-

Speed Components Ltd

Israel . 1,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,282

-

-

-

-

J2 Sourcing AB

Sweden . 521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

521

-

-

-

-

PC Components Company LLC

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Bristol Electronics

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$5.697

100+ parts

$5.184

1k+ parts

$4.672

10k+ parts

-

450

$5.697

$5.184

$4.672

-

AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$16.810

100+ parts

-

1k+ parts

-

10k+ parts

-

553

$16.810

-

-

-

Kepictronics

USA . 27,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,860

-

-

-

-

SupplyDigital Components

Austria . 7,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,386

-

-

-

-

Kulean Microsystems

USA . 6,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,957

-

-

-

-

Problanco Electronics

Mexico . 6,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,025

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,159

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Corphita

USA . 1,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

-

-

-

-

UHIMA Technologies

Türkiye . 957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

957

-

-

-

-

Vigor

Singapore . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

-

Corohmni

South Africa . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

358

-

-

-

-

TANS Electronics

Latvia . 248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

248

-

-

-

-

Microchip USA

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Overview

Unlock the power of efficient and reliable Power Management ICs with the NIS5101E2T1G by Onsemi. Built with superior quality and precision, this small outline rectangular package offers a nominal supply voltage of 48V and features a gull wing terminal finish for seamless integration. Ideal for power supply support circuits, this innovative product is designed to enhance performance while maximizing energy efficiency. Elevate your projects with the cutting-edge technology and unmatched value of the NIS5101E2T1G from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature makes it easier to integrate the IC into electronic circuits, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 48 V

With a nominal supply voltage of 48V, this IC is suitable for applications requiring higher voltages, providing reliable power management.

No. of Terminals: 7

The 7 terminals offer flexibility in connecting the IC to other components, allowing for versatile power management configurations.

Terminal Finish: TIN

The tin terminal finish ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Maximum Seated Height: 2.03 mm

The low maximum seated height allows for a compact design, making it suitable for space-constrained applications.

Width (mm): 8 mm

The 8mm width provides compatibility with standard electronic layouts and designs, ensuring easy integration into various systems.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC enhances the efficiency and performance of power management systems, making it a valuable component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures the IC's reliability during the soldering process, making it suitable for diverse manufacturing environments.

Length: 9.395 mm

The 9.395mm length offers a compact form factor, making it ideal for applications where space is limited.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and easy soldering, ensuring a secure connection and efficient assembly.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch offers compatibility with standard PCB layouts, allowing for easy integration and precise connections.

Technical Specifications

Power Management ICs NIS5101E2T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

REQUIRES A NEGATIVE VOLTAGE OF -48V

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

9.395 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SMSIP7H,.4,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Power Management Circuits

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Width (mm):

8 mm

Trade Compliance

NIS5101E2T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19