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NIS5020MT1TXG

Onsemi

NIS5020MT1TXG by Onsemi

NIS5020MT1TXG by Onsemi is a Power Management IC with 12V nominal voltage, -40 to 150 °C operating temperature range, and automotive grade. It features a square package shape, 11 terminals, and matte tin terminal finish. Ideal for power supply support circuits in automotive applications.

Median Price

$1.039

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119,653 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

119,653

-

$1.020

$0.847

$0.755

DigiKey

USA . 119,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.270

10k+ parts

-

119,653

-

-

$1.270

-

Farnell

UK . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.630

63,000

-

-

-

$0.630

Verical

USA . 62,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.058

10k+ parts

$0.944

62,653

-

-

$1.058

$0.944

Flip Electronics (Authorized)

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 382 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$0.630

-

-

-

Digiode

USA . 2,340 parts In-Stock

1+ parts

$0.791

100+ parts

-

1k+ parts

-

10k+ parts

-

2,340

$0.791

-

-

-

Flip Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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11,500

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.398

1k+ parts

$0.738

10k+ parts

-

3,000

-

$1.398

$0.738

-

Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,755 parts In-Stock

1+ parts

$0.492

100+ parts

-

1k+ parts

-

10k+ parts

-

2,755

$0.492

-

-

-

Corohmni

South Africa . 150 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.630

-

-

-

Corphita

USA . 337 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$0.750

-

-

-

Kulean Microsystems

USA . 5,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,752

-

-

-

-

SupplyDigital Components

Austria . 1,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,652

-

-

-

-

Microchip USA

USA . 1,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,577

-

-

-

-

UHIMA Technologies

Türkiye . 786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

786

-

-

-

-

TANS Electronics

Latvia . 163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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163

-

-

-

-

Problanco Electronics

Mexico . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9

-

-

-

-

Overview

Experience the next level of power management with the NIS5020MT1TXG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality ICs designed for automotive applications. This surface-mount device offers reliability, efficiency, and performance, making it a versatile solution for various power supply support circuits. With a wide operating temperature range and compact design, this product ensures seamless integration and optimized functionality. Trust Onsemi to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, reducing assembly time and costs.

Nominal Supply Voltage (Vsup): 12 V

Suitable for applications requiring a stable 12V power supply, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in harsh environments or demanding applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures functionality in extreme cold conditions.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and slim package style saves space on PCBs and enables design flexibility in compact electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the overall durability of the product.

Width (mm): 3 mm

Slim width allows for efficient use of space on circuit boards, ideal for compact electronic designs.

Temperature Grade: AUTOMOTIVE

Built to withstand automotive environments, ensuring reliable operation in vehicles and automotive applications.

Terminal Form: NO LEAD

No lead terminal form meets environmental regulations and promotes eco-friendly manufacturing processes.

Technical Specifications

Power Management ICs NIS5020MT1TXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XBCC-N11

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+8.5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NIS5020MT1TXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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