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NIS5101B1T4

Onsemi

NIS5101B1T4 by Onsemi

NIS5101B1T4 by Onsemi is a Power Management IC with 7 terminals in a small outline package. It features Gull Wing terminal form, Tin Lead finish, and is surface mountable. Ideal for power supply support circuits due to its compact size (10.18mm x 8.4mm) and low seated height of 4.67mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,165 parts In-Stock

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2,165

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Digiode

USA . 1,504 parts In-Stock

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1,504

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Distributors (Availability)

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Kulean Microsystems

USA . 6,781 parts In-Stock

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6,781

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Problanco Electronics

Mexico . 4,772 parts In-Stock

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4,772

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TANS Electronics

Latvia . 3,490 parts In-Stock

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3,490

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SupplyDigital Components

Austria . 2,695 parts In-Stock

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2,695

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Corphita

USA . 2,365 parts In-Stock

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2,365

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UHIMA Technologies

Türkiye . 358 parts In-Stock

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358

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Corohmni

South Africa . 154 parts In-Stock

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154

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Overview

Enhance your power management solutions with the NIS5101B1T4 by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product is designed to optimize performance while ensuring efficiency. With Onsemi's commitment to excellence, customers can trust in the value, benefits, and advantages that the NIS5101B1T4 brings to their projects. Upgrade your power management systems today and experience the difference with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space on the PCB layout.

No. of Terminals: 7

Having 7 terminals enables the IC to support multiple connections and functions.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes the footprint on the PCB, making it suitable for compact designs.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity for reliable connections.

Maximum Seated Height: 4.67 mm

Low seated height allows for a slim profile design, beneficial for space-constrained applications.

Width (mm): 8.4 mm

Compact width size enables the IC to fit into tight spaces within the device.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product ensures stable power delivery for the device, enhancing performance and reliability.

Length: 10.18 mm

The length of 10.18 mm provides a balance between compact size and functional requirements.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical stability during soldering and handling, contributing to the product's overall durability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise placement of the IC on the PCB, ensuring accurate connections and signal integrity.

Technical Specifications

Power Management ICs NIS5101B1T4 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

REQUIRES A NEGATIVE VOLTAGE OF -48V

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e0

Length:

10.18 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SMSIP7H,.55,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

4.67 mm

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Width (mm):

8.4 mm

Trade Compliance

NIS5101B1T4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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