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NCV7520FPR2G

Onsemi

NCV7520FPR2G by Onsemi

NCV7520FPR2G by Onsemi is a MOSFET gate driver with a supply voltage range of 4.45V to 5.55V, ideal for automotive applications. It features a turn-on/off time of 2us and operates in temperatures ranging from -40°C to 125°C. This surface-mount driver has 32 terminals and is AEC-Q100 qualified.

Median Price

$6.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 568 parts In-Stock

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$6.080

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Vyrian

USA . 1,342 parts In-Stock

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$6.400

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Chip Stock

USA . 29,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 626 parts In-Stock

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$3.000

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Ampacity Inc.

Singapore . 2,508 parts In-Stock

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$5.440

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Corphita

USA . 758 parts In-Stock

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$5.760

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Corohmni

South Africa . 309 parts In-Stock

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$6.400

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$11.702

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$10.649

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$9.596

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$11.702

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Microchip USA

USA . 4,901 parts In-Stock

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$18.327

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Component Stockers USA

USA . 1,943 parts In-Stock

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$38.890

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SupplyDigital Components

Austria . 7,644 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,926 parts In-Stock

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TANS Electronics

Latvia . 3,319 parts In-Stock

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Kulean Microsystems

USA . 2,474 parts In-Stock

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Netroflash

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UHIMA Technologies

Türkiye . 619 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 94 parts In-Stock

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Overview

Enhance the performance of your automotive applications with the NCV7520FPR2G MOSFET Gate Driver by Onsemi. With a robust design and high-quality materials, this product offers reliable operation even in challenging conditions. Its advanced features and compatibility make it ideal for a wide range of automotive applications. Experience enhanced efficiency and precision with the NCV7520FPR2G, providing you with the value and benefits you need to excel in your projects. Trust Onsemi's reputation for excellence and invest in the NCV7520FPR2G for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making the product suitable for various environments.

Maximum Supply Voltage: 5.25 V

Allows for efficient power management without risking damage to the device.

Screening Level: AEC-Q100

Ensures high quality and reliability, meeting automotive industry standards.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Nominal Supply Voltage: 5 V

Provides stable power supply for consistent performance.

Technical Specifications

MOSFET Gate Drivers NCV7520FPR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.55 V

Minimum Supply Voltage-1:

4.45 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

2 us

Turn-on Time:

2 us

Width:

5 mm

Trade Compliance

NCV7520FPR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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