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NCV7517FTR2G

Onsemi

NCV7517FTR2G by Onsemi

NCV7517FTR2G by Onsemi is a MOSFET gate driver with 32 terminals, operating at -40 to 125 °C. It has a supply voltage range of 4.75-5.25 V and turn-on/off time of 1000 us, suitable for automotive applications requiring high temperature tolerance and precise power control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,874 parts In-Stock

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Digiode

USA . 1,120 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 605 parts In-Stock

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605

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$6.827

100+ parts

$6.213

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$5.598

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2,000

$6.827

$6.213

$5.598

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AZTECH Wire

Italy . 134 parts In-Stock

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$18.010

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Kulean Microsystems

USA . 6,340 parts In-Stock

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Kepictronics

USA . 6,263 parts In-Stock

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Problanco Electronics

Mexico . 3,547 parts In-Stock

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TANS Electronics

Latvia . 3,082 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,904 parts In-Stock

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Corphita

USA . 1,464 parts In-Stock

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Microchip USA

USA . 464 parts In-Stock

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UHIMA Technologies

Türkiye . 393 parts In-Stock

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Vigor

Singapore . 382 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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Overview

Enhance your automotive applications with the NCV7517FTR2G by Onsemi. This MOSFET Gate Driver offers unrivaled quality and reliability, thanks to Onsemi's reputable manufacturing standards. With a wide operating temperature range and AEC-Q100 screening level, this product ensures optimal performance in demanding environments. Its compact square package design and low profile make it suitable for space-constrained applications. Experience faster turn-on and turn-off times, seamless integration, and improved efficiency with the NCV7517FTR2G. Drive your projects to success with this high-performance solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and components.

Screening Level: AEC-Q100

AEC-Q100 screening level indicates reliability and quality, important for automotive and other high-performance applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments.

Technical Specifications

MOSFET Gate Drivers NCV7517FTR2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Turn-off Time:

1000 us

Turn-on Time:

1000 us

Width:

7 mm

Trade Compliance

NCV7517FTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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