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NCV7517FTG

Onsemi

NCV7517FTG by Onsemi

NCV7517FTG by Onsemi is a MOSFET gate driver with 32 terminals, operating at -40 to 125 °C. It has a supply voltage range of 4.75-5.25V and turn-on/off time of 1000µs, suitable for automotive applications requiring a buffer or inverter-based interface IC type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 12,242 parts In-Stock

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Digiode

USA . 1,364 parts In-Stock

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AZTECH Wire

Italy . 598 parts In-Stock

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$17.030

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598

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QUARKTWIN TECHNOLOGY LTD

USA . 11,774 parts In-Stock

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Problanco Electronics

Mexico . 5,794 parts In-Stock

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Kulean Microsystems

USA . 4,636 parts In-Stock

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Metaverse IC Inc.

Canada . 4,114 parts In-Stock

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SupplyDigital Components

Austria . 3,698 parts In-Stock

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Microchip USA

USA . 1,410 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,044 parts In-Stock

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UHIMA Technologies

Türkiye . 861 parts In-Stock

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Kepictronics

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Vigor

Singapore . 548 parts In-Stock

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Corohmni

South Africa . 484 parts In-Stock

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Overview

Unleash the power of your automotive applications with the NCV7517FTG by Onsemi, a top-tier MOSFET Gate Driver that promises unmatched performance and reliability. Crafted with precision by Onsemi, a trusted name in semiconductor manufacturing, this advanced driver offers seamless integration and superior control over power supplies, making it ideal for a wide range of automotive systems. Elevate your projects with the NCV7517FTG and experience the quality, value, and innovation that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage provides flexibility and compatibility with different power sources.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets automotive industry standards for reliability and performance.

Package Shape: SQUARE

The square shape of the package allows for efficient layout and space utilization on a PCB.

Power Supplies (V): 5

The product operates at a standard power supply voltage of 5V, making it compatible with most systems.

No. of Terminals: 32

The high number of terminals allow for connectivity to multiple components, increasing versatility and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space and allows for easy integration into compact designs.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, providing reliability in varying conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in extreme cold environments.

Terminal Finish: TIN

The use of tin terminal finish ensures good solderability and resistance to corrosion, prolonging the lifespan of the product.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.6 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for compact designs.

Width: 7 mm

The compact width of 7mm allows for efficient use of space on a PCB, ideal for tight layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Length: 7 mm

The short length of 7mm contributes to the compact form factor of the product, enabling it to fit in small spaces.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is designed to meet the stringent requirements of automotive applications, ensuring high reliability.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly, enhancing the product's overall durability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easy.

Turn-on Time: 1000 us

The fast turn-on time of 1000 microseconds ensures quick response and high performance in switching applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high density mounting on a PCB, enabling compact and space-efficient designs.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based MOSFET driver interface IC type provides flexibility in driving MOSFETs, enhancing the versatility of the product.

Turn-off Time: 1000 us

The fast turn-off time of 1000 microseconds ensures efficient switching and control of MOSFETs, improving overall system performance.

Technical Specifications

MOSFET Gate Drivers NCV7517FTG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Turn-off Time:

1000 us

Turn-on Time:

1000 us

Width:

7 mm

Trade Compliance

NCV7517FTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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