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NCV7341D21G

Onsemi

NCV7341D21G by Onsemi

NCV7341D21G by Onsemi is a 14-terminal network interface with a 5V power supply, operating b/w -40 to 125 °C. It features a data rate of 1 Mbps and is ideal for automotive applications requiring AEC-Q100 screening, such as interface circuits in telecom systems.

Median Price

$0.951

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$0.951

1k+ parts

$0.790

10k+ parts

$0.704

110

-

$0.951

$0.790

$0.704

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 296 parts In-Stock

1+ parts

$0.741

100+ parts

-

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10k+ parts

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296

$0.741

-

-

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Vyrian

USA . 5,766 parts In-Stock

1+ parts

-

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5,766

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 990 parts In-Stock

1+ parts

$0.702

100+ parts

-

1k+ parts

-

10k+ parts

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990

$0.702

-

-

-

Vigor

Singapore . 231 parts In-Stock

1+ parts

$0.750

100+ parts

-

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231

$0.750

-

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Corohmni

South Africa . 468 parts In-Stock

1+ parts

$0.780

100+ parts

-

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468

$0.780

-

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-

Ampacity Inc.

Singapore . 110 parts In-Stock

1+ parts

$1.440

100+ parts

-

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110

$1.440

-

-

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AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

-

10k+ parts

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1,165

$9.480

-

-

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TANS Electronics

Latvia . 4,641 parts In-Stock

1+ parts

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4,641

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Kulean Microsystems

USA . 4,415 parts In-Stock

1+ parts

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4,415

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-

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Problanco Electronics

Mexico . 4,239 parts In-Stock

1+ parts

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4,239

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SupplyDigital Components

Austria . 1,489 parts In-Stock

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1,489

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UHIMA Technologies

Türkiye . 757 parts In-Stock

1+ parts

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757

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Microchip USA

USA . 494 parts In-Stock

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494

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Perfect Parts

USA . 457 parts In-Stock

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457

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Overview

Discover the NCV7341D21G by Onsemi, a top-quality network interface designed to meet the highest industry standards. With a focus on automotive applications, this product offers reliable performance and seamless connectivity for your projects. Trust in Onsemi's reputation for excellence in manufacturing to deliver a product that exceeds expectations. Experience the value and benefits of this interface circuit, providing you with the competitive edge you need. Unlock new possibilities with the NCV7341D21G and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards suitable for automotive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Data Rate: 1 Mbps

The data rate of 1 Mbps enables fast and efficient transmission of data over the network, ensuring smooth communication.

Technical Specifications

Network Interfaces NCV7341D21G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.6868 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7341D21G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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