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NCV7341D20G

Onsemi

NCV7341D20G by Onsemi

NCV7341D20G by Onsemi is a 14-terminal interface circuit with a 5V supply voltage, operating b/w -40 to 125 °C. It is designed for automotive applications, featuring a small outline package style and gull wing terminal form. With a data rate of 1 Mbps and AEC-Q100 screening level, it is ideal for network interfaces in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,900 parts In-Stock

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Digiode

USA . 1,535 parts In-Stock

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1,535

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AZTECH Wire

Italy . 273 parts In-Stock

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$16.270

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273

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Problanco Electronics

Mexico . 8,327 parts In-Stock

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Microchip USA

USA . 5,940 parts In-Stock

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TANS Electronics

Latvia . 5,102 parts In-Stock

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5,102

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Kulean Microsystems

USA . 2,301 parts In-Stock

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2,301

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UHIMA Technologies

Türkiye . 814 parts In-Stock

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814

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Corphita

USA . 666 parts In-Stock

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666

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Vigor

Singapore . 356 parts In-Stock

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356

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SupplyDigital Components

Austria . 346 parts In-Stock

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Corohmni

South Africa . 59 parts In-Stock

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Overview

Unlock seamless connectivity with the NCV7341D20G by Onsemi. Crafted with precision and reliability, this network interface solution offers unparalleled performance in automotive applications. From its robust construction to its high-quality materials, this product is designed to exceed expectations. Say goodbye to connectivity issues and hello to smooth operations with the NCV7341D20G. Trust Onsemi for cutting-edge technology that delivers value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mount enables easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality standards for automotive electronic components.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power sources and ensures stable performance.

Package Style: SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact automotive electronic designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions in automotive applications.

Data Rate: 1 Mbps

The high data rate of 1 Mbps allows for fast and efficient communication between devices in automotive networks.

Technical Specifications

Network Interfaces NCV7341D20G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.6868 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7341D20G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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