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NCV70624DW010G

Onsemi

NCV70624DW010G by Onsemi

NCV70624DW010G by Onsemi is a Motion Control IC with 20 terminals, operating at supply voltages of 5-29V. It features a max output current of 0.8A and is designed for stepper motor control applications. The package style is small outline, making it suitable for compact designs requiring precise motion control.

Median Price

$5.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,335 parts In-Stock

1+ parts

$5.240

100+ parts

$4.930

1k+ parts

$4.450

10k+ parts

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1,335

$5.240

$4.930

$4.450

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Distributors (In-Stock)

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Digiode

USA . 551 parts In-Stock

1+ parts

$4.978

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551

$4.978

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Vyrian

USA . 5,178 parts In-Stock

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5,178

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Flip Electronics

USA . 2,090 parts In-Stock

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2,090

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Distributors (Availability)

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Corphita

USA . 1,202 parts In-Stock

1+ parts

$4.716

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1,202

$4.716

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Corohmni

South Africa . 334 parts In-Stock

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$5.240

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334

$5.240

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Vigor

Singapore . 960 parts In-Stock

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$7.550

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960

$7.550

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AZTECH Wire

Italy . 575 parts In-Stock

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$16.750

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575

$16.750

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TANS Electronics

Latvia . 8,200 parts In-Stock

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Problanco Electronics

Mexico . 6,418 parts In-Stock

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SupplyDigital Components

Austria . 3,523 parts In-Stock

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Kulean Microsystems

USA . 2,844 parts In-Stock

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2,844

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UHIMA Technologies

Türkiye . 635 parts In-Stock

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635

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Microchip USA

USA . 494 parts In-Stock

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Overview

Unlock the power of precision and efficiency with the NCV70624DW010G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Motion Control ICs. This product is perfect for a wide range of applications, offering seamless control and optimized performance. With a nominal supply voltage of 14V and maximum output current of 0.8A, the NCV70624DW010G provides unparalleled value and benefits to customers looking to enhance their motion control systems. Experience the difference with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and reliability for the package, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space during assembly.

Nominal Supply Voltage (Vsup): 14 V

Operating at a nominal supply voltage of 14V provides a stable power source for the motion control IC, ensuring consistent performance.

Power Supplies (V): 5,6.5/29

Support for a range of power supply voltages, from 5V to 29V, offers flexibility in powering the device in different systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, enabling versatile integration with other components in a system.

Maximum Output Current: 0.8 A

With a maximum output current of 0.8A, the motion control IC can drive higher power loads efficiently, expanding its range of applications.

Technical Specifications

Motion Control ICs NCV70624DW010G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.7762 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.6416 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5184 mm

Trade Compliance

NCV70624DW010G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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