Loading...

NCV70521MN003G

Onsemi

NCV70521MN003G by Onsemi

NCV70521MN003G by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6-30V, and output current of 1.6A. It is ideal for automotive applications due to its low profile design, matte tin finish, and wide temperature range (-40 to 125 °C).

Median Price

$2.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$2.560

1k+ parts

$2.290

10k+ parts

$2.150

15

-

$2.560

$2.290

$2.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 618 parts In-Stock

1+ parts

$2.822

100+ parts

-

1k+ parts

-

10k+ parts

-

618

$2.822

-

-

-

Chip Stock

USA . 53,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53,000

-

-

-

-

Vyrian

USA . 7,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,257

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 538 parts In-Stock

1+ parts

$2.673

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$2.673

-

-

-

Vigor

Singapore . 397 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$2.850

-

-

-

Corohmni

South Africa . 375 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$2.970

-

-

-

Component Stockers USA

USA . 16 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$3.050

-

-

-

AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$8.250

100+ parts

-

1k+ parts

-

10k+ parts

-

683

$8.250

-

-

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Problanco Electronics

Mexico . 7,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,129

-

-

-

-

TANS Electronics

Latvia . 5,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,517

-

-

-

-

Kulean Microsystems

USA . 4,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,828

-

-

-

-

Kepictronics

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

UHIMA Technologies

Türkiye . 377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

377

-

-

-

-

Microchip USA

USA . 128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

128

-

-

-

-

SupplyDigital Components

Austria . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Upgrade your motion control system with the NCV70521MN003G by Onsemi. With a focus on quality and reliability, Onsemi offers cutting-edge technology in the field of Motion Control ICs. This surface-mount chip carrier boasts a wide range of applications, making it suitable for various industries. Providing a nominal supply voltage of 12V and maximum output current of 1.6A, this product delivers exceptional performance. Experience seamless operation and efficiency with the NCV70521MN003G, designed to meet your specific needs and exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, making this product convenient for manufacturing processes.

Nominal Supply Voltage (Vsup): 12 V

Operating at a standard 12 V supply voltage provides compatibility with common power sources, ensuring ease of integration into existing systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a combination of compactness, efficient heat dissipation, and robust design, making the product versatile and suitable for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliability and longevity in operation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good electrical conductivity and solderability, enhancing the product's performance and reliability in circuit connections.

Width (mm): 7 mm

Compact 7 mm width allows for space-efficient mounting on circuit boards, enabling the product to be used in applications where size constraints are a concern.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for temperature performance and durability, making it a suitable choice for automotive systems.

Maximum Output Current: 1.6 A

High maximum output current capability of 1.6 A enables the product to drive stepper motors effectively, allowing for precise and powerful motion control.

Technical Specifications

Motion Control ICs NCV70521MN003G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6/30

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

NCV70521MN003G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20