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NCV70516MW0R2G

Onsemi

NCV70516MW0R2G by Onsemi

NCV70516MW0R2G by Onsemi is a Motion Control IC with 24 terminals, operating voltage range of 6-29V, and temp. range of -40 to 145 °C. It is a Stepper Motor Controller suitable for automotive applications due to its compact square package shape and surface mount design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,427 parts In-Stock

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Digiode

USA . 1,090 parts In-Stock

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AZTECH Wire

Italy . 755 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,306 parts In-Stock

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TANS Electronics

Latvia . 5,973 parts In-Stock

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Microchip USA

USA . 4,419 parts In-Stock

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Problanco Electronics

Mexico . 4,093 parts In-Stock

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Kulean Microsystems

USA . 3,491 parts In-Stock

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Corphita

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Corohmni

South Africa . 465 parts In-Stock

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SupplyDigital Components

Austria . 453 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Overview

Experience the power of precision with the NCV70516MW0R2G by Onsemi. This motion control IC boasts top-notch quality and reliability, making it ideal for a wide range of applications. From automotive systems to industrial automation, this product offers unparalleled value and performance. With its advanced features and user-friendly design, customers can trust that they are getting a superior product that will exceed their expectations. Choose Onsemi for all your motion control needs and see the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Ease of installation and compatibility with surface mount technology make this product convenient for electronic assembly processes.

Package Shape: SQUARE

Square packages are often more compact and allow for efficient use of space on a circuit board.

Nominal Supply Voltage (Vsup): 14 V

Suitable voltage range for powering the motion control IC, providing optimal performance.

No. of Terminals: 24

Sufficient number of terminals for connecting to various components and peripherals, allowing for versatile applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging enhances thermal management and overall product compactness.

Maximum Operating Temperature: 145 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes this product suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal configuration enables easy PCB layout and routing, simplifying the design process.

Maximum Seated Height: 0.9 mm

Low profile design helps in creating compact and slim electronic devices.

Width (mm): 5 mm

Narrow width allows for space-saving integration in tight layouts.

Other IC type: STEPPER MOTOR CONTROLLER

Specialized for controlling stepper motors, offering precise motion control capabilities.

Minimum Supply Voltage (Vsup): 6 V

Wide voltage range allows for flexibility in power supply options.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time ensures proper soldering of the component during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability enables reliable solder joints for durability.

Length: 5 mm

Compact length contributes to overall space efficiency on the PCB.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliable performance in automotive applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards.

Terminal Pitch: 0.65 mm

Fine pitch terminals allow for high-density mounting and space optimization on the PCB.

Maximum Supply Voltage (Vsup): 29 V

Higher maximum voltage rating provides a safety margin and versatility in power supply options.

Technical Specifications

Motion Control ICs NCV70516MW0R2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

145 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCV70516MW0R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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