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NCV70501DW002G

Onsemi

NCV70501DW002G by Onsemi

Onsemi's NCV70501DW002G is a Motion Control IC with 16 terminals, operating voltage range of 6-29V, and max output current of 0.3A. Ideal for automotive applications due to its bipolar technology, it features a small outline package style and can withstand temperatures from -40 to 125 °C.

Median Price

$1.720

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 187 parts In-Stock

1+ parts

$1.720

100+ parts

$1.620

1k+ parts

$1.460

10k+ parts

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187

$1.720

$1.620

$1.460

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,156 parts In-Stock

1+ parts

$1.634

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1,156

$1.634

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Vyrian

USA . 1,975 parts In-Stock

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$1.720

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1,975

$1.720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 148 parts In-Stock

1+ parts

$1.548

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-

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148

$1.548

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Corohmni

South Africa . 317 parts In-Stock

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$1.720

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317

$1.720

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Vigor

Singapore . 197 parts In-Stock

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$2.320

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197

$2.320

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Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$9.069

100+ parts

$8.253

1k+ parts

$7.437

10k+ parts

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87

$9.069

$8.253

$7.437

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AZTECH Wire

Italy . 124 parts In-Stock

1+ parts

$11.190

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124

$11.190

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Problanco Electronics

Mexico . 8,211 parts In-Stock

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8,211

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TANS Electronics

Latvia . 7,318 parts In-Stock

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7,318

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SupplyDigital Components

Austria . 7,142 parts In-Stock

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7,142

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Kulean Microsystems

USA . 1,696 parts In-Stock

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1,696

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UHIMA Technologies

Türkiye . 346 parts In-Stock

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346

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Microchip USA

USA . 110 parts In-Stock

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110

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Overview

Enhance the performance of your motion control systems with the NCV70501DW002G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and efficiency. Perfect for various applications in automotive settings, this stepper motor controller offers unparalleled value with its compact design, versatile features, and wide operating temperature range. Say goodbye to subpar performance - trust Onsemi to provide you with the best-in-class solutions for your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, making the product suitable for automated assembly processes.

Power Supplies (V): 6/29

Wide range of power supply voltages (6V to 29V) make this product versatile and compatible with a variety of applications and systems.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance (up to 125 °C) ensures reliability and stability even in harsh temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature (-40 °C) allows for usage in cold environments without sacrificing performance.

Technology: BIPOLAR

Bipolar technology offers precise control and efficient power management, making this product suitable for high-performance motion control applications.

Technical Specifications

Motion Control ICs NCV70501DW002G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/29

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCV70501DW002G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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