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NCV33064D-5R2

Onsemi

NCV33064D-5R2 by Onsemi

NCV33064D-5R2 by Onsemi is a Power Management IC with 8 terminals, operating b/w -40 to 125 °C. It supports power supplies of 5V and has a nominal voltage of 4V. Ideal for automotive applications due to its technology and small outline package style.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 3,782 parts In-Stock

1+ parts

$1.690

100+ parts

$1.270

1k+ parts

$1.100

10k+ parts

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3,782

$1.690

$1.270

$1.100

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Vyrian

USA . 3,320 parts In-Stock

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3,320

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Digiode

USA . 2,413 parts In-Stock

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2,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 149 parts In-Stock

1+ parts

$1.690

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149

$1.690

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AZTECH Wire

Italy . 246 parts In-Stock

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$18.580

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246

$18.580

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SupplyDigital Components

Austria . 7,546 parts In-Stock

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7,546

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Problanco Electronics

Mexico . 7,070 parts In-Stock

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7,070

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TANS Electronics

Latvia . 3,885 parts In-Stock

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RC Electronics

USA . 3,600 parts In-Stock

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3,600

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Kulean Microsystems

USA . 1,763 parts In-Stock

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1,763

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Corphita

USA . 1,593 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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876

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Microchip USA

USA . 272 parts In-Stock

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272

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Vigor

Singapore . 123 parts In-Stock

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123

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Overview

Looking for a reliable Power Management IC to enhance your automotive applications? Look no further than the NCV33064D-5R2 by Onsemi. With its high-quality plastic/epoxy package, small outline style, and wide temperature range, this IC ensures optimal performance even in harsh conditions. Trust in Onsemi's reputation for excellence in power supplies support circuits to deliver the best value and benefits to your projects. Upgrade your systems with the NCV33064D-5R2 today and experience enhanced efficiency and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for power management ICs as it provides good insulation and protection from external elements, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space in the manufacturing process.

Nominal Supply Voltage (Vsup): 4 V

This voltage is within the common operating range for power management ICs, making it compatible with a variety of applications.

No. of Terminals: 8

Having 8 terminals allows for sufficient connections to power sources and other components, enhancing the versatility of the IC.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the IC can withstand demanding conditions without compromising performance.

Technology: BIPOLAR

Bipolar technology is known for its stable performance and low noise, making it ideal for power management applications where precision is crucial.

Technical Specifications

Power Management ICs NCV33064D-5R2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.6V

Width (mm):

3.9 mm

Trade Compliance

NCV33064D-5R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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