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NCV301LSN33T1G

Onsemi

NCV301LSN33T1G by Onsemi

NCV301LSN33T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package with dual terminals and operates in temperatures from -40 °C to 125°C. This CMOS technology IC supports power supply circuits efficiently.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,975 parts In-Stock

1+ parts

$0.320

100+ parts

$0.168

1k+ parts

$0.141

10k+ parts

$0.127

8,975

$0.320

$0.168

$0.141

$0.127

Mouser Electronics

USA . 5,195 parts In-Stock

1+ parts

$0.320

100+ parts

$0.168

1k+ parts

$0.141

10k+ parts

$0.128

5,195

$0.320

$0.168

$0.141

$0.128

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,617 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

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1,617

$0.370

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Vyrian

USA . 2,379 parts In-Stock

1+ parts

$0.390

100+ parts

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2,379

$0.390

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Chip Stock

USA . 16,200 parts In-Stock

1+ parts

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16,200

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

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$0.204

6,000

-

-

-

$0.204

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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$0.154

3,000

-

-

-

$0.154

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,532 parts In-Stock

1+ parts

$0.332

100+ parts

-

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2,532

$0.332

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Vigor

Singapore . 713 parts In-Stock

1+ parts

$0.350

100+ parts

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713

$0.350

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Corphita

USA . 458 parts In-Stock

1+ parts

$0.351

100+ parts

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458

$0.351

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Corohmni

South Africa . 483 parts In-Stock

1+ parts

$0.390

100+ parts

-

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483

$0.390

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Microchip USA

USA . 4,369 parts In-Stock

1+ parts

$1.838

100+ parts

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4,369

$1.838

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Component Stockers USA

USA . 58,460 parts In-Stock

1+ parts

$2.100

100+ parts

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58,460

$2.100

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iodParts Technologies Inc.

India . 25,494 parts In-Stock

1+ parts

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25,494

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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SupplyDigital Components

Austria . 7,845 parts In-Stock

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7,845

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Kulean Microsystems

USA . 5,508 parts In-Stock

1+ parts

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5,508

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Problanco Electronics

Mexico . 4,410 parts In-Stock

1+ parts

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4,410

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Kepictronics

USA . 4,100 parts In-Stock

1+ parts

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4,100

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UHIMA Technologies

Türkiye . 905 parts In-Stock

1+ parts

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905

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TANS Electronics

Latvia . 543 parts In-Stock

1+ parts

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543

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Overview

Unlock the power of efficient and reliable power management with the NCV301LSN33T1G by Onsemi. Manufactured to the highest standards, this Power Management IC offers a wide range of applications and benefits for customers seeking top-notch performance. Whether you're looking to optimize energy consumption or enhance system reliability, this product delivers unparalleled value with its small outline, dual-terminal design and wide operating temperature range. Trust Onsemi's expertise in technology and innovation to meet all your power supply support circuit needs. Elevate your projects with the NCV301LSN33T1G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for a wide range of applications, offering flexibility and compatibility with different systems.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments, making it suitable for various industrial applications.

Technology: CMOS

Consumes low power and offers high noise immunity, enhancing the efficiency and reliability of the power management IC.

Technical Specifications

Power Management ICs NCV301LSN33T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.3V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCV301LSN33T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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