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NCV300LSN30T1G

Onsemi

NCV300LSN30T1G by Onsemi

NCV300LSN30T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package with dual terminals and operates b/w -40 °C to 125°C. This CMOS technology IC supports power supplies and has a matte tin terminal finish.

Median Price

$0.424

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 450,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.910

10k+ parts

$0.910

450,000

-

-

$0.910

$0.910

Flip Electronics (Authorized)

USA . 450,000 parts In-Stock

1+ parts

-

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450,000

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-

-

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Rochester

USA . 10,841 parts In-Stock

1+ parts

-

100+ parts

$0.409

1k+ parts

$0.340

10k+ parts

$0.303

10,841

-

$0.409

$0.340

$0.303

Verical

USA . 4,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.424

10k+ parts

$0.379

4,675

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-

$0.424

$0.379

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,167 parts In-Stock

1+ parts

$0.910

100+ parts

-

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1,167

$0.910

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Flip Electronics

USA . 447,000 parts In-Stock

1+ parts

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447,000

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Chip Stock

USA . 11,000 parts In-Stock

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11,000

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Digiode

USA . 1,167 parts In-Stock

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1,167

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Distributors (Availability)

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Vigor

Singapore . 230 parts In-Stock

1+ parts

$0.320

100+ parts

-

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230

$0.320

-

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Corohmni

South Africa . 132 parts In-Stock

1+ parts

$0.910

100+ parts

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132

$0.910

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Ampacity Inc.

Singapore . 449,739 parts In-Stock

1+ parts

$1.680

100+ parts

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449,739

$1.680

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RC Electronics

USA . 57,976 parts In-Stock

1+ parts

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57,976

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Problanco Electronics

Mexico . 7,718 parts In-Stock

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7,718

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TANS Electronics

Latvia . 4,719 parts In-Stock

1+ parts

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4,719

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Kulean Microsystems

USA . 1,819 parts In-Stock

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1,819

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SupplyDigital Components

Austria . 1,064 parts In-Stock

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1,064

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Corphita

USA . 567 parts In-Stock

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567

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Microchip USA

USA . 374 parts In-Stock

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374

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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1

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Overview

Enhance your power management capabilities with the NCV300LSN30T1G from Onsemi. Designed with precision and reliability in mind, this Power Management IC offers a wide range of applications in automotive and industrial settings. With a compact design and advanced technology, this product provides efficient power supply support with a nominal threshold voltage of +3.0V. Trust in Onsemi's reputation for quality and innovation and experience the value and benefits that the NCV300LSN30T1G brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for use in a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort.

Nominal Supply Voltage (Vsup): 1.5 V

A stable supply voltage of 1.5V ensures reliable and consistent performance of the power management IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments, this IC is suitable for automotive power management applications.

Technical Specifications

Power Management ICs NCV300LSN30T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.0V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCV300LSN30T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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