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NCV303LSN25T1G

Onsemi

NCV303LSN25T1G by Onsemi

NCV303LSN25T1G by Onsemi is a Power Management IC with a Nominal Voltage of 1.5V, suitable for automotive applications. It features a Max Operating Temperature of 125°C and Terminal Finish in Matte Tin, making it ideal for power supply support circuits. This small outline IC has a dual terminal position and operates within a wide temperature range from -40°C to 125°C.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 18,364 parts In-Stock

1+ parts

$0.330

100+ parts

$0.174

1k+ parts

$0.146

10k+ parts

$0.137

18,364

$0.330

$0.174

$0.146

$0.137

DigiKey

USA . 1,868 parts In-Stock

1+ parts

$0.330

100+ parts

$0.174

1k+ parts

$0.146

10k+ parts

$0.132

1,868

$0.330

$0.174

$0.146

$0.132

Flip Electronics (Authorized)

USA . 24,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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24,917

-

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EBV Elektronik

Germany . 6,000 parts In-Stock

1+ parts

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6,000

-

-

-

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Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.118

3,000

-

-

-

$0.118

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,730 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

$0.110

-

-

-

Digiode

USA . 757 parts In-Stock

1+ parts

$0.437

100+ parts

-

1k+ parts

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10k+ parts

-

757

$0.437

-

-

-

Flip Electronics

USA . 24,917 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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24,917

-

-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.185

6,000

-

-

-

$0.185

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

6,000

-

-

-

$0.167

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

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600

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,470 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

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11,470

$0.093

-

-

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Vigor

Singapore . 225 parts In-Stock

1+ parts

$0.354

100+ parts

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225

$0.354

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Corphita

USA . 1,082 parts In-Stock

1+ parts

$0.414

100+ parts

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1,082

$0.414

-

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$0.460

100+ parts

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478

$0.460

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Microchip USA

USA . 5,949 parts In-Stock

1+ parts

$1.838

100+ parts

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5,949

$1.838

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Problanco Electronics

Mexico . 6,403 parts In-Stock

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6,403

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Kulean Microsystems

USA . 5,708 parts In-Stock

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5,708

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 1,152 parts In-Stock

1+ parts

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1,152

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TANS Electronics

Latvia . 1,058 parts In-Stock

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1,058

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UHIMA Technologies

Türkiye . 885 parts In-Stock

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885

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Overview

Discover the NCV303LSN25T1G by Onsemi, a high-quality Power Management IC that offers outstanding value and benefits to customers. With Onsemi's reputation for superior manufacturing, this IC ensures reliability and efficiency in various applications. From power supply support circuits to automotive systems, this compact and versatile IC provides stable voltage regulation with a wide operating temperature range. Upgrade your electronic designs with the NCV303LSN25T1G and experience exceptional performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and improving the overall design.

Nominal Supply Voltage (Vsup): 1.5 V

The low nominal supply voltage helps in reducing power consumption and heat dissipation, making it energy efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for usage in extreme cold environments without impacting performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product suitable for a variety of applications.

Maximum Seated Height: 1.1 mm

The low seated height enables compact and slim designs, ideal for space-constrained applications.

Width (mm): 1.5 mm

The small width contributes to the overall compact size of the product, making it suitable for miniaturized applications.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage allows for operation even in low power scenarios, ensuring flexibility and compatibility.

Technical Specifications

Power Management ICs NCV303LSN25T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCV303LSN25T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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