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NCV300LSN36T1G

Onsemi

NCV300LSN36T1G by Onsemi

NCV300LSN36T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, matte tin terminal finish, and operates in temperatures from -40 °C to 125°C. This CMOS technology IC has dual terminals and a peak reflow temperature of 260°C.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,376 parts In-Stock

1+ parts

$0.350

100+ parts

$0.185

1k+ parts

$0.155

10k+ parts

$0.142

3,376

$0.350

$0.185

$0.155

$0.142

DigiKey

USA . 29,046 parts In-Stock

1+ parts

$0.410

100+ parts

$0.218

1k+ parts

$0.184

10k+ parts

$0.167

29,046

$0.410

$0.218

$0.184

$0.167

Rochester

USA . 99,800 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.141

10k+ parts

$0.126

99,800

-

$0.170

$0.141

$0.126

Verical

USA . 99,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.157

99,800

-

-

-

$0.157

Flip Electronics (Authorized)

USA . 3,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,685

-

-

-

-

EBV Elektronik

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,903 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

-

1,903

$0.132

-

-

-

Vyrian

USA . 806 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$0.139

-

-

-

Flip Electronics

USA . 3,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,685

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,148 parts In-Stock

1+ parts

$0.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$0.125

-

-

-

Corohmni

South Africa . 194 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$0.139

-

-

-

Component Stockers USA

USA . 211,320 parts In-Stock

1+ parts

$0.140

100+ parts

$0.140

1k+ parts

$0.120

10k+ parts

$0.120

211,320

$0.140

$0.140

$0.120

$0.120

Vigor

Singapore . 462 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

462

$0.600

-

-

-

Kepictronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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42,000

-

-

-

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SupplyDigital Components

Austria . 3,034 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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3,034

-

-

-

-

TANS Electronics

Latvia . 1,964 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,964

-

-

-

-

Problanco Electronics

Mexico . 1,207 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,207

-

-

-

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Kulean Microsystems

USA . 959 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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959

-

-

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-

UHIMA Technologies

Türkiye . 337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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337

-

-

-

-

Perfect Parts

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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112

-

-

-

-

Overview

Discover the NCV300LSN36T1G by Onsemi, a top-tier Power Management IC designed to deliver optimal performance and efficiency. With Onsemi's reputation for quality and innovation, this product offers unparalleled reliability and precision in various applications. From automotive systems to consumer electronics, this small outline, thin profile IC provides stable power supplies and support circuits with ease. Experience the value and benefits of Onsemi's cutting-edge technology, ensuring your devices operate at peak performance levels. Elevate your designs with the NCV300LSN36T1G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for the package, ensuring long-term performance of the power management IC.

Surface Mount: YES

Surface mount capability makes the IC easy to install on a PCB, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 1.5 V

Operating at a low nominal supply voltage of 1.5V makes this power management IC suitable for low power applications, helping to conserve energy.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can withstand extreme cold conditions, making it suitable for use in a wide range of environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the power management IC efficient and reliable.

Technical Specifications

Power Management ICs NCV300LSN36T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.6V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.6V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCV300LSN36T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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