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NCP6335LFCCT1G

Onsemi

NCP6335LFCCT1G by Onsemi

NCP6335LFCCT1G by Onsemi is a Power Management IC with 20 terminals, Vsup range of 2.3V to 5.5V, and operating temperature from -40 °C to 85°C. It features adjustable threshold and is suitable for industrial applications requiring power supply support circuits in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,041 parts In-Stock

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Digiode

USA . 1,773 parts In-Stock

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1,773

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Kulean Microsystems

USA . 7,224 parts In-Stock

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SupplyDigital Components

Austria . 6,848 parts In-Stock

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TANS Electronics

Latvia . 2,446 parts In-Stock

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Corphita

USA . 1,491 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Corohmni

South Africa . 77 parts In-Stock

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Problanco Electronics

Mexico . 75 parts In-Stock

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Overview

Enhance your power management solutions with the NCP6335LFCCT1G by Onsemi. Crafted with precision and quality, this power management IC offers reliability and efficiency like no other. Perfect for a wide range of applications, from consumer electronics to industrial machinery, this product guarantees optimal performance and seamless integration. Experience the value and benefits of choosing Onsemi as your trusted manufacturer, and elevate your projects with the cutting-edge technology of the NCP6335LFCCT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the power management IC, making it suitable for various applications and environments.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and reducing assembly costs.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures compatibility with standard power sources, making integration into existing systems seamless.

No. of Terminals: 20

Having 20 terminals provides flexibility in connections and functionality, allowing for a wide range of power management capabilities.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this power management IC can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C ensures reliable performance in harsh environments or extreme conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safety margin for power input, protecting the IC from voltage spikes or fluctuations.

Adjustable Threshold: YES

The adjustable threshold feature allows for fine-tuning of voltage levels, providing precise control and customization for specific power management needs.

Technical Specifications

Power Management ICs NCP6335LFCCT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B20

Length:

2.02 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.62 mm

Trade Compliance

NCP6335LFCCT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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