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NCP6335DFCCT1G

Onsemi

NCP6335DFCCT1G by Onsemi

NCP6335DFCCT1G by Onsemi is a Power Management IC with 20 terminals, Vsup range of 2.3V to 5.5V, and adjustable threshold feature. It has a very thin profile package style suitable for industrial applications requiring supply voltage regulation in the -40 °C to 85°C temperature range.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 450,000 parts In-Stock

1+ parts

-

100+ parts

$0.509

1k+ parts

$0.423

10k+ parts

$0.377

450,000

-

$0.509

$0.423

$0.377

Verical

USA . 444,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

444,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,107 parts In-Stock

1+ parts

$0.391

100+ parts

-

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-

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2,107

$0.391

-

-

-

Vyrian

USA . 8,037 parts In-Stock

1+ parts

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8,037

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 218 parts In-Stock

1+ parts

$0.371

100+ parts

-

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218

$0.371

-

-

-

Vigor

Singapore . 423 parts In-Stock

1+ parts

$0.400

100+ parts

-

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423

$0.400

-

-

-

Corohmni

South Africa . 323 parts In-Stock

1+ parts

$0.412

100+ parts

-

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323

$0.412

-

-

-

AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$14.600

100+ parts

-

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964

$14.600

-

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Kulean Microsystems

USA . 7,759 parts In-Stock

1+ parts

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7,759

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-

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Problanco Electronics

Mexico . 7,547 parts In-Stock

1+ parts

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7,547

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Perfect Parts

USA . 5,124 parts In-Stock

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5,124

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SupplyDigital Components

Austria . 4,662 parts In-Stock

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4,662

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TANS Electronics

Latvia . 2,279 parts In-Stock

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2,279

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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GreenTree Electronics

Israel . 825 parts In-Stock

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825

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Microchip USA

USA . 315 parts In-Stock

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315

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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220

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Overview

Enhance your power management solutions with the NCP6335DFCCT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are designed for optimal performance and reliability. This versatile component is perfect for a wide range of applications, offering customers unparalleled value and efficiency. Say goodbye to power supply issues and hello to seamless operation with the NCP6335DFCCT1G. Trust Onsemi to provide you with the best-in-class products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier assembly and integration onto PCBs, saving space and enabling compact designs.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6 V nominal supply voltage ensures compatibility with standard power sources, making it versatile for different power management applications.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and enables the IC to handle multiple input and output connections efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can perform reliably in various environmental conditions without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to operate effectively in cold environments without any performance issues.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in setting the operating parameters based on specific requirements, enhancing the versatility of the IC.

Technical Specifications

Power Management ICs NCP6335DFCCT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B20

Length:

2.02 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.62 mm

Trade Compliance

NCP6335DFCCT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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