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NCP6992AMWTXG

Onsemi

NCP6992AMWTXG by Onsemi

NCP6992AMWTXG by Onsemi is a Power Management IC with 5 channels, adjustable threshold, and 12V nominal voltage. It is designed for industrial applications, operates b/w -40 to 85 °C, and comes in a square chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,237 parts In-Stock

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Vyrian

USA . 206 parts In-Stock

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Kulean Microsystems

USA . 3,926 parts In-Stock

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Problanco Electronics

Mexico . 2,532 parts In-Stock

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SupplyDigital Components

Austria . 1,576 parts In-Stock

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UHIMA Technologies

Türkiye . 962 parts In-Stock

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TANS Electronics

Latvia . 761 parts In-Stock

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Corphita

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Corohmni

South Africa . 125 parts In-Stock

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Overview

Enhance the efficiency and performance of your power management systems with the NCP6992AMWTXG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their Power Management ICs. Ideal for a wide range of applications, this product offers exceptional value by providing customers with optimized power supply support circuits, adjustable thresholds, and industrial-grade temperature resilience. Upgrade your systems today with the NCP6992AMWTXG and experience the benefits of superior power management capabilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and improving overall product reliability.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is common in many electronic systems, making this IC compatible with a wide range of applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style provides efficient heat dissipation and a compact design, making it suitable for applications where space is limited and thermal management is crucial.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can reliably function in a wide range of environmental conditions.

Width (mm): 7 mm

The compact width of 7mm allows for the IC to be used in space-constrained applications without sacrificing performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with low-power systems, offering flexibility in design and application.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies that this IC is suitable for use in harsh industrial environments, providing reliability and durability.

No. of Channels: 5

With 5 channels, this IC can support multiple power supply circuits, making it versatile for various system requirements.

Maximum Supply Voltage (Vsup): 22 V

The maximum supply voltage of 22V allows for compatibility with a wide range of power sources, making this IC versatile for different applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and optimization of voltage thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs NCP6992AMWTXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

NCP6992AMWTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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