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NCP380LMU15AATBG

Onsemi

NCP380LMU15AATBG by Onsemi

NCP380LMU15AATBG by Onsemi is a Power Management IC with 5V Nominal Voltage, -40 to 85 °C Operating Temperature Range, and 6 Terminals. It is used in industrial applications for power supply support circuits due to its small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,568 parts In-Stock

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Digiode

USA . 2,080 parts In-Stock

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Vigor

Singapore . 322 parts In-Stock

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$0.200

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322

$0.200

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AZTECH Wire

Italy . 970 parts In-Stock

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$10.060

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Component Stockers USA

USA . 295 parts In-Stock

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$99.990

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Kepictronics

USA . 42,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,439 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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TANS Electronics

Latvia . 4,980 parts In-Stock

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SupplyDigital Components

Austria . 4,295 parts In-Stock

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Kulean Microsystems

USA . 4,094 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,826 parts In-Stock

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Corphita

USA . 1,646 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 191 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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UHIMA Technologies

Türkiye . 54 parts In-Stock

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Overview

Unlock the power of efficient power management with the NCP380LMU15AATBG by Onsemi. Crafted by a trusted manufacturer, this Power Management IC offers reliable performance for a wide range of applications. With a compact design and high-quality materials, this product ensures seamless integration into your projects. Experience the benefits of stable supply voltage and temperature control without compromising on space or functionality. Upgrade your devices with the NCP380LMU15AATBG and enjoy enhanced performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, providing good protection for the internal components of the IC.

Nominal Supply Voltage (Vsup): 5 V

Operates at a common and stable supply voltage, making it compatible with a wide range of devices and applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures, making it suitable for a variety of environmental conditions.

Maximum Seated Height: 0.55 mm

Low profile design allows for space-saving installation in compact electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

Can function at a low supply voltage, providing flexibility in power input requirements.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes, ensuring reliable solder connections.

Technical Specifications

Power Management ICs NCP380LMU15AATBG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NCP380LMU15AATBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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