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NCP367OPMUECTBG

Onsemi

NCP367OPMUECTBG by Onsemi

NCP367OPMUECTBG by Onsemi is a Power Management IC with 8 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.2V to 28V and adjustable threshold feature. This IC is ideal for industrial applications requiring small outline, heat sink package style with surface mount capability.

Median Price

$0.032

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 18,000 parts In-Stock

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$0.032

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18,000

$0.032

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Vyrian

USA . 4,530 parts In-Stock

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4,530

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Digiode

USA . 1,167 parts In-Stock

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1,167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 307 parts In-Stock

1+ parts

$0.430

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307

$0.430

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AZTECH Wire

Italy . 662 parts In-Stock

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$21.320

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662

$21.320

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SupplyDigital Components

Austria . 5,093 parts In-Stock

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5,093

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TANS Electronics

Latvia . 4,639 parts In-Stock

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4,639

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,219 parts In-Stock

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Microchip USA

USA . 2,042 parts In-Stock

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2,042

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Problanco Electronics

Mexico . 1,072 parts In-Stock

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Kulean Microsystems

USA . 399 parts In-Stock

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399

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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369

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Corohmni

South Africa . 100 parts In-Stock

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100

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Overview

Enhance the performance of your power management systems with the NCP367OPMUECTBG from Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides exceptional value and benefits, ensuring optimal efficiency and functionality. Trust in Onsemi to deliver innovative solutions that exceed expectations and elevate your projects to new heights. Choose the NCP367OPMUECTBG for superior performance and unmatched advantages in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and insulation for the Power Management IC, making it a reliable choice for various electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.5 V

The 3.5V nominal supply voltage ensures compatibility with a wide range of electronic devices, making this Power Management IC versatile for different applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in a variety of environmental conditions, making it suitable for industrial applications where temperature fluctuations are common.

Technical Specifications

Power Management ICs NCP367OPMUECTBG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

2.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NCP367OPMUECTBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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