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NCP347MTAITBG

Onsemi

NCP347MTAITBG by Onsemi

NCP347MTAITBG by Onsemi is a Power Management IC with 5V nominal voltage, 10 terminals, and max operating temp of 85 °C. Ideal for industrial applications requiring power supply management circuits in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,160 parts In-Stock

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Digiode

USA . 1,734 parts In-Stock

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AZTECH Wire

Italy . 154 parts In-Stock

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$9.000

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Problanco Electronics

Mexico . 8,150 parts In-Stock

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SupplyDigital Components

Austria . 7,590 parts In-Stock

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Kulean Microsystems

USA . 3,476 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 2,551 parts In-Stock

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Kepictronics

USA . 1,120 parts In-Stock

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Assy Fe

Spain . 1,080 parts In-Stock

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Futuretech Components

Singapore . 690 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 453 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Discover the NCP347MTAITBG by Onsemi, a top-quality Power Management IC designed to optimize power supplies in a variety of applications. With its small outline package and wide operating temperature range, this innovative product offers unmatched reliability and performance. Whether you're looking to enhance efficiency in industrial systems or streamline power management in consumer electronics, the NCP347MTAITBG delivers exceptional value, benefits, and advantages that will exceed your expectations. Trust Onsemi for cutting-edge solutions that elevate your power management capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic devices, making this IC compatible with a wide range of applications.

No. of Terminals: 10

Having 10 terminals allows for more connections and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability under various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in cold environments.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and solderability.

Length: 2.5 mm

The compact length of 2.5mm saves valuable space on the PCB.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures reliability in harsh environments.

Maximum Supply Current (Isup): 0.25 mA

The low maximum supply current of 0.25mA helps in reducing power consumption.

Technical Specifications

Power Management ICs NCP347MTAITBG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e3

Length:

2.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NCP347MTAITBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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