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NCP308SN330T1G

Onsemi

NCP308SN330T1G by Onsemi

NCP308SN330T1G by Onsemi is a Power Management IC with 3.3V nominal voltage, 1.6-5.5V power supplies range, and -40 to 125°C operating temperature. It is ideal for automotive applications due to its small outline package style and adjustable threshold feature.

Median Price

$0.533

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,889 parts In-Stock

1+ parts

-

100+ parts

$0.513

1k+ parts

$0.426

10k+ parts

$0.380

5,889

-

$0.513

$0.426

$0.380

Verical

USA . 4,394 parts In-Stock

1+ parts

-

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$0.533

10k+ parts

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4,394

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-

$0.533

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Element14

Singapore . 2 parts In-Stock

1+ parts

-

100+ parts

$0.697

1k+ parts

$0.684

10k+ parts

$0.656

2

-

$0.697

$0.684

$0.656

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.482

100+ parts

-

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10

$0.482

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Flip Electronics

USA . 42,000 parts In-Stock

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42,000

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Chip Stock

USA . 24,500 parts In-Stock

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24,500

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Vyrian

USA . 4,671 parts In-Stock

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4,671

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ACDS - Activité Composants Distribution Service

France . 1,500 parts In-Stock

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1,500

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Holdelec - ElecDif-Pro

France . 1,500 parts In-Stock

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1,500

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Digiode

USA . 421 parts In-Stock

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421

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Distributors (Availability)

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Corohmni

South Africa . 338 parts In-Stock

1+ parts

$0.472

100+ parts

-

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338

$0.472

-

-

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Argo Parts USA

USA . 4,751 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

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10k+ parts

$0.468

4,751

$0.482

-

-

$0.468

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

$0.458

10k+ parts

$0.448

1,000

$0.482

-

$0.458

$0.448

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$0.590

100+ parts

-

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2

$0.590

-

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Semicontronic

India . 2 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

-

2

$0.590

$0.575

$0.572

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Continental Prestige Electronics

USA . 1,113 parts In-Stock

1+ parts

$0.693

100+ parts

$0.452

1k+ parts

$0.315

10k+ parts

-

1,113

$0.693

$0.452

$0.315

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Vigor

Singapore . 878 parts In-Stock

1+ parts

$1.060

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878

$1.060

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Microchip USA

USA . 4,483 parts In-Stock

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$2.924

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4,483

$2.924

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AZTECH Wire

Italy . 357 parts In-Stock

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$6.134

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357

$6.134

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Aztec Data Supply Inc.

USA . 230 parts In-Stock

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$24.400

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230

$24.400

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Kepictronics

USA . 30,000 parts In-Stock

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Futuretech Components

Singapore . 21,000 parts In-Stock

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Lixinc

USA . 19,021 parts In-Stock

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Problanco Electronics

Mexico . 4,541 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

USA . 1,977 parts In-Stock

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TANS Electronics

Latvia . 1,242 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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648

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Kulean Microsystems

USA . 624 parts In-Stock

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SupplyDigital Components

Austria . 255 parts In-Stock

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Overview

Enhance your power management solutions with the NCP308SN330T1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This Power Management IC is versatile and efficient, suitable for a wide range of applications. With a nominal supply voltage of 3.3V and adjustable threshold, this IC offers superior performance and flexibility. Trust Onsemi to deliver cutting-edge technology that meets your power supply needs, making it a valuable addition to any project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the Power Management IC, making it a reliable choice for long-term use.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic devices, making this Power Management IC versatile for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this Power Management IC can withstand elevated temperatures without compromising performance, ideal for use in industrial or automotive environments.

Technology: CMOS

The CMOS technology used in this Power Management IC allows for low power consumption and efficient operation, making it energy-efficient and cost-effective for different electronic systems.

Adjustable Threshold: YES

The ability to adjust the threshold voltage in this Power Management IC provides flexibility in voltage regulation, allowing for customization and optimization based on specific application requirements.

Technical Specifications

Power Management ICs NCP308SN330T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

THRESHOLD VOLTAGE IS 3.07V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP308SN330T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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