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NCP304LSQ46T1

Onsemi

NCP304LSQ46T1 by Onsemi

NCP304LSQ46T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 °C to 85°C. This CMOS technology IC supports power supply circuits in compact designs.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,603 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

45,603

-

$0.225

$0.186

$0.166

Verical

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

24,000

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,108 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

1,108

$0.175

-

-

-

Vyrian

USA . 5,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 322 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

322

$0.160

-

-

-

Corphita

USA . 1,361 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$0.166

-

-

-

Vigor

Singapore . 298 parts In-Stock

1+ parts

$0.180

100+ parts

-

1k+ parts

-

10k+ parts

-

298

$0.180

-

-

-

Component Stockers USA

USA . 52,534 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

$0.160

52,534

$0.190

$0.180

$0.160

$0.160

AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$10.690

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$10.690

-

-

-

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$16.482

100+ parts

$14.999

1k+ parts

$13.515

10k+ parts

-

900

$16.482

$14.999

$13.515

-

Continental Prestige Electronics

USA . 45,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.160

10k+ parts

-

45,603

-

-

$0.160

-

TANS Electronics

Latvia . 6,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,526

-

-

-

-

Problanco Electronics

Mexico . 4,613 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,613

-

-

-

-

SupplyDigital Components

Austria . 1,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,083

-

-

-

-

UHIMA Technologies

Türkiye . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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600

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-

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-

Kulean Microsystems

USA . 278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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278

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-

-

-

Microchip USA

USA . 248 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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248

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-

Overview

Enhance your power management solutions with the NCP304LSQ46T1 by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power Management ICs that are designed for efficiency and reliability. This compact and versatile product is perfect for a wide range of applications, providing customers with consistent performance and peace of mind. With a focus on innovation and customer satisfaction, Onsemi sets the standard for excellence in the industry. Upgrade your power management system today with the NCP304LSQ46T1 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy materials are typically lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Nominal Supply Voltage (Vsup): 1.5 V

A low nominal supply voltage of 1.5V allows the product to operate efficiently while consuming less power.

No. of Terminals: 4

Having a small number of terminals simplifies the connection and integration of the product into the overall system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C ensures the product can operate reliably in a wide range of temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog circuits.

Technical Specifications

Power Management ICs NCP304LSQ46T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.6V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.6V

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ46T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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