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NCP304LSQ30T1G

Onsemi

NCP304LSQ30T1G by Onsemi

NCP304LSQ30T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 °C to 85°C. This CMOS technology IC supports power supply circuits in compact designs.

Median Price

$0.241

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 373 parts In-Stock

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-

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$0.241

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$0.200

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$0.178

373

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$0.241

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$0.178

Distributors (In-Stock)

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Digiode

USA . 2,482 parts In-Stock

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$0.188

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$0.188

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Chip Stock

USA . 16,230 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,286 parts In-Stock

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Bristol Electronics

USA . 2,286 parts In-Stock

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Dan-Mar Components

USA . 2,286 parts In-Stock

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Vyrian

USA . 2,223 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 680 parts In-Stock

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$0.178

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680

$0.178

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Corohmni

South Africa . 382 parts In-Stock

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$0.198

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382

$0.198

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Component Stockers USA

USA . 356 parts In-Stock

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$0.200

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$0.190

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356

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$0.190

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Vigor

Singapore . 750 parts In-Stock

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$0.590

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750

$0.590

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Andel Nordic

Denmark . 1,079 parts In-Stock

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$7.880

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$5.513

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$5.513

1,079

$7.880

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$5.513

AZTECH Wire

Italy . 859 parts In-Stock

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$8.510

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Perfect Parts

USA . 20,821 parts In-Stock

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Futuretech Components

Singapore . 12,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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RC Electronics

USA . 6,141 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,084 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,983 parts In-Stock

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iodParts Technologies Inc.

India . 2,286 parts In-Stock

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SupplyDigital Components

Austria . 2,258 parts In-Stock

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UHIMA Technologies

Türkiye . 813 parts In-Stock

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TANS Electronics

Latvia . 290 parts In-Stock

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Microchip USA

USA . 175 parts In-Stock

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Overview

Experience superior power management with the NCP304LSQ30T1G by Onsemi. As a leader in the industry, Onsemi's Power Management ICs are renowned for their quality and reliability. This small outline, thin profile package offers a wide range of applications, making it an essential component for various electronic devices. With a nominal supply voltage of 1.5V and a maximum supply voltage of 10V, this IC provides efficient power support while operating in industrial-grade temperatures. Trust Onsemi to deliver top-notch performance and value with the NCP304LSQ30T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving designs.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V is suitable for various applications and power requirements.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the power management IC to other components.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Power Management ICs NCP304LSQ30T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0036 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ30T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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