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NCP304LSQ25T1

Onsemi

NCP304LSQ25T1 by Onsemi

NCP304LSQ25T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40 °C to 85°C. Ideal for power supply support circuits in various electronic devices.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,272 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

18,272

-

$0.225

$0.186

$0.166

Avnet

USA . 18,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.200

10k+ parts

$0.180

18,272

-

-

$0.200

$0.180

Verical

USA . 9,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

9,606

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,105 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

$0.175

-

-

-

Vyrian

USA . 6,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,981

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$0.160

-

-

-

Corphita

USA . 254 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$0.166

-

-

-

Vigor

Singapore . 250 parts In-Stock

1+ parts

$0.180

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$0.180

-

-

-

Component Stockers USA

USA . 23,205 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

$0.160

23,205

$0.190

$0.180

$0.160

$0.160

AZTECH Wire

Italy . 898 parts In-Stock

1+ parts

$22.100

100+ parts

-

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10k+ parts

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898

$22.100

-

-

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Continental Prestige Electronics

USA . 18,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.160

10k+ parts

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18,272

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-

$0.160

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TANS Electronics

Latvia . 6,857 parts In-Stock

1+ parts

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6,857

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Kulean Microsystems

USA . 4,009 parts In-Stock

1+ parts

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4,009

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Problanco Electronics

Mexico . 3,134 parts In-Stock

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3,134

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SupplyDigital Components

Austria . 1,865 parts In-Stock

1+ parts

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1,865

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UHIMA Technologies

Türkiye . 470 parts In-Stock

1+ parts

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470

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Microchip USA

USA . 371 parts In-Stock

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371

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Overview

Enhance your power management capabilities with the NCP304LSQ25T1 by Onsemi. Designed with top-quality materials and cutting-edge technology, this Power Management IC offers unparalleled reliability and efficiency in a compact package. Ideal for a wide range of applications, this product provides customers with the peace of mind that comes from using a trusted brand like Onsemi. From industrial settings to consumer electronics, the NCP304LSQ25T1 delivers unmatched performance and value, making it the smart choice for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and assembly.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable nominal supply voltage of 1.5V ensures compatibility with a wide range of devices and applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and fast operation, making the product efficient and reliable.

Technical Specifications

Power Management ICs NCP304LSQ25T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.5V

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ25T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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