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NCP304LSQ09T1G

Onsemi

NCP304LSQ09T1G by Onsemi

NCP304LSQ09T1G by Onsemi is a Power Management IC with 0.8-10V power supplies, 0.85V nominal voltage, and +0.9V threshold voltage. It is used in industrial applications for power supply support circuits due to its small outline, thin profile package style and CMOS technology.

Median Price

$0.232

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,908 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

35,908

-

$0.241

$0.200

$0.178

Verical

USA . 18,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.223

18,000

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-

-

$0.223

Distributors (In-Stock)

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Digiode

USA . 979 parts In-Stock

1+ parts

$0.188

100+ parts

-

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979

$0.188

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Vyrian

USA . 2,100 parts In-Stock

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2,100

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Distributors (Availability)

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Corphita

USA . 1,088 parts In-Stock

1+ parts

$0.178

100+ parts

-

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1,088

$0.178

-

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Vigor

Singapore . 924 parts In-Stock

1+ parts

$0.190

100+ parts

-

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924

$0.190

-

-

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Corohmni

South Africa . 407 parts In-Stock

1+ parts

$0.198

100+ parts

-

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407

$0.198

-

-

-

Component Stockers USA

USA . 52,191 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

52,191

$0.200

$0.190

$0.170

$0.170

Andel Nordic

Denmark . 2,546 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$1.164

10k+ parts

$1.164

2,546

$1.660

-

$1.164

$1.164

AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$14.600

100+ parts

-

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506

$14.600

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Continental Prestige Electronics

USA . 35,908 parts In-Stock

1+ parts

-

100+ parts

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$0.165

10k+ parts

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35,908

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-

$0.165

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Kepictronics

USA . 30,000 parts In-Stock

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30,000

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Problanco Electronics

Mexico . 6,195 parts In-Stock

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6,195

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TANS Electronics

Latvia . 5,049 parts In-Stock

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5,049

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UHIMA Technologies

Türkiye . 586 parts In-Stock

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586

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Kulean Microsystems

USA . 585 parts In-Stock

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585

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SupplyDigital Components

Austria . 563 parts In-Stock

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563

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Microchip USA

USA . 320 parts In-Stock

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320

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Overview

Enhance your power management capabilities with the NCP304LSQ09T1G by Onsemi. This high-quality Power Management IC offers superior performance and reliability, thanks to Onsemi's expertise in designing cutting-edge semiconductor solutions. Ideal for a wide range of applications, this product provides exceptional value by ensuring efficient power supply support with minimal energy consumption. Trust Onsemi to deliver innovative solutions that meet your power management needs, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 0.85 V

Optimal nominal supply voltage ensures efficient power management and performance of the device.

Power Supplies (V): 0.8/10

Wide range of power supply options allows for versatility in application and compatibility with different systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable operation even in challenging environmental conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates that the product is suitable for use in harsh industrial settings where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Power Management ICs NCP304LSQ09T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 0.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.003 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ09T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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