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NCP304HSQ20T1

Onsemi

NCP304HSQ20T1 by Onsemi

NCP304HSQ20T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, CMOS technology, and operates b/w -40 °C to 85°C. With surface mount capability and dual terminals, it offers efficient power supply support in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Mil-Aero Solutions, Inc.

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,862 parts In-Stock

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Connector Distribution Corp

USA . 900 parts In-Stock

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900

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Right Parts Inc.

USA . 900 parts In-Stock

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900

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Digiode

USA . 132 parts In-Stock

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132

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AZTECH Wire

Italy . 135 parts In-Stock

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$14.500

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135

$14.500

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Component Stockers USA

USA . 775 parts In-Stock

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$99.990

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775

$99.990

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SupplyDigital Components

Austria . 4,298 parts In-Stock

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Problanco Electronics

Mexico . 2,056 parts In-Stock

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TANS Electronics

Latvia . 1,913 parts In-Stock

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Kulean Microsystems

USA . 1,346 parts In-Stock

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Corphita

USA . 1,160 parts In-Stock

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Vigor

Singapore . 870 parts In-Stock

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Microchip USA

USA . 463 parts In-Stock

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Overview

Discover the NCP304HSQ20T1 by Onsemi, a cutting-edge Power Management IC that combines top-notch quality with unparalleled reliability. Designed for a wide range of applications, this innovative product offers customers exceptional value and benefits. With Onsemi's reputation for excellence in manufacturing, you can trust that this Power Management IC will deliver outstanding performance, making it the ideal choice for your power supply support circuit needs. Unlock the potential of your electronic devices with the NCP304HSQ20T1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness, making the product long-lasting and affordable.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures compatibility with a wide range of devices, making it versatile and widely usable.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C ensures reliability in extreme conditions, making it suitable for various environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and reliability, ensuring stable performance over time.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Power Management ICs NCP304HSQ20T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0033 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Width (mm):

1.25 mm

Trade Compliance

NCP304HSQ20T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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