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NCP303LSN44T1

Onsemi

NCP303LSN44T1 by Onsemi

NCP303LSN44T1 by Onsemi is a Power Management IC with 5 terminals, operating from -40 to 125 °C. It supports supply voltages from 0.8V to 10V and has a threshold voltage of +4.4V. Ideal for automotive applications due to its compact size and low power consumption of 0.0012 mA.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

6,870

-

$0.238

$0.197

$0.176

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,256 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

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1,256

$0.185

-

-

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Vyrian

USA . 6,807 parts In-Stock

1+ parts

-

100+ parts

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6,807

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,378 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

6,378

$0.166

-

-

-

Corphita

USA . 2,128 parts In-Stock

1+ parts

$0.176

100+ parts

-

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2,128

$0.176

-

-

-

Vigor

Singapore . 281 parts In-Stock

1+ parts

$0.190

100+ parts

-

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281

$0.190

-

-

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

$0.195

100+ parts

-

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60

$0.195

-

-

-

AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$19.350

100+ parts

-

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379

$19.350

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RC Electronics

USA . 61,200 parts In-Stock

1+ parts

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61,200

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SupplyDigital Components

Austria . 7,895 parts In-Stock

1+ parts

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100+ parts

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7,895

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TANS Electronics

Latvia . 7,395 parts In-Stock

1+ parts

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7,395

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Kulean Microsystems

USA . 7,157 parts In-Stock

1+ parts

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7,157

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Continental Prestige Electronics

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.178

10k+ parts

-

6,870

-

-

$0.178

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Problanco Electronics

Mexico . 1,744 parts In-Stock

1+ parts

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100+ parts

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1,744

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UHIMA Technologies

Türkiye . 806 parts In-Stock

1+ parts

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806

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Microchip USA

USA . 167 parts In-Stock

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167

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Overview

Experience reliable power management with the NCP303LSN44T1 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality Power Management ICs that cater to a wide range of applications. This product offers customers the value of efficient power supply support circuitry in a compact and durable package. With a wide operating temperature range and automotive-grade technology, the NCP303LSN44T1 ensures optimal performance in various environments. Trust Onsemi to provide cutting-edge solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and lightweight solution for power management ICs.

Surface Mount: YES

Enables easy and efficient PCB assembly process.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for low power applications with a moderate supply voltage requirement.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Technology: CMOS

Utilizes low power consumption CMOS technology for efficient power management.

Technical Specifications

Power Management ICs NCP303LSN44T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN44T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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