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NCP303LSN33T1G

Onsemi

NCP303LSN33T1G by Onsemi

NCP303LSN33T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V thresholds at +3.3V. Ideal for automotive applications due to its temp grade and CMOS technology, it supports power supplies in compact form factor with 5 terminals and dual position.

Median Price

$0.241

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4 parts In-Stock

1+ parts

$2.140

100+ parts

-

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4

$2.140

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Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

6,000

-

$0.241

$0.200

$0.178

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.156

3,000

-

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-

$0.156

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 748 parts In-Stock

1+ parts

$0.188

100+ parts

-

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748

$0.188

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DF Sales Co.

USA . 2,970 parts In-Stock

1+ parts

$3.200

100+ parts

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2,970

$3.200

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DF Sales Co.

USA . 2,970 parts In-Stock

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$3.200

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2,970

$3.200

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Chip Stock

USA . 11,400 parts In-Stock

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11,400

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Vyrian

USA . 8,475 parts In-Stock

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8,475

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LIBRA Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Sensible Micro Corp

USA . 2,955 parts In-Stock

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2,955

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 999 parts In-Stock

1+ parts

$0.178

100+ parts

-

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999

$0.178

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Corohmni

South Africa . 301 parts In-Stock

1+ parts

$0.198

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301

$0.198

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Vigor

Singapore . 750 parts In-Stock

1+ parts

$0.630

100+ parts

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750

$0.630

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AZTECH Wire

Italy . 1,129 parts In-Stock

1+ parts

$20.050

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1,129

$20.050

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$26.104

100+ parts

$23.755

1k+ parts

$21.405

10k+ parts

-

700

$26.104

$23.755

$21.405

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Component Stockers USA

USA . 247 parts In-Stock

1+ parts

$99.990

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247

$99.990

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Perfect Parts

USA . 24,554 parts In-Stock

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24,554

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Kepictronics

USA . 18,869 parts In-Stock

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18,869

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 4,083 parts In-Stock

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4,083

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Problanco Electronics

Mexico . 3,046 parts In-Stock

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3,046

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SupplyDigital Components

Austria . 2,973 parts In-Stock

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2,973

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Microchip USA

USA . 2,089 parts In-Stock

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2,089

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Kulean Microsystems

USA . 991 parts In-Stock

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991

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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770

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Futuretech Components

Singapore . 691 parts In-Stock

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691

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Discover the power of reliable and efficient Power Management ICs with the NCP303LSN33T1G by Onsemi. Manufactured with precision and expertise, this small outline, thin profile IC offers a wide range of applications in automotive and industrial settings. With a nominal supply voltage of 1.5V and a temperature grade of automotive, this IC ensures optimal performance in challenging environments. Trust Onsemi for quality and innovation, and experience the value and benefits that the NCP303LSN33T1G brings to your power supply support circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable makes installation easier and allows for more compact designs in electronic devices.

Nominal Supply Voltage (Vsup): 1.5 V

The 1.5V nominal supply voltage ensures compatibility with a wide range of electronic devices requiring different voltage inputs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this Power Management IC can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this Power Management IC efficient and reliable for various applications.

Technical Specifications

Power Management ICs NCP303LSN33T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.3V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN33T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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