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NCP303LSN22T1G

Onsemi

NCP303LSN22T1G by Onsemi

NCP303LSN22T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V thresholds at +2.2V. Ideal for automotive applications due to its temp grade and compact design in small outline package style.

Median Price

$0.470

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 236 parts In-Stock

1+ parts

$0.220

100+ parts

$0.220

1k+ parts

$0.210

10k+ parts

-

236

$0.220

$0.220

$0.210

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Newark

USA . 2,199 parts In-Stock

1+ parts

$0.470

100+ parts

$0.236

1k+ parts

$0.182

10k+ parts

-

2,199

$0.470

$0.236

$0.182

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Farnell

UK . 2,199 parts In-Stock

1+ parts

$0.485

100+ parts

$0.191

1k+ parts

$0.126

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2,199

$0.485

$0.191

$0.126

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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3,000

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Distributors (In-Stock)

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Digiode

USA . 2,390 parts In-Stock

1+ parts

$0.186

100+ parts

-

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2,390

$0.186

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Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$0.195

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96

$0.195

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Flip Electronics

USA . 3,000 parts In-Stock

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-

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3,000

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Electronics Depot

USA . 1,745 parts In-Stock

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1,745

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Vyrian

USA . 1,363 parts In-Stock

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1,363

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ComSIT Distribution GmbH

Germany . 813 parts In-Stock

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813

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Distributors (Availability)

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Corphita

USA . 2,194 parts In-Stock

1+ parts

$0.176

100+ parts

-

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2,194

$0.176

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Corohmni

South Africa . 205 parts In-Stock

1+ parts

$0.187

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205

$0.187

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Ampacity Inc.

Singapore . 1,453 parts In-Stock

1+ parts

$0.363

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1,453

$0.363

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Vigor

Singapore . 320 parts In-Stock

1+ parts

$0.500

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320

$0.500

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AZTECH Wire

Italy . 170 parts In-Stock

1+ parts

$18.730

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170

$18.730

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QUARKTWIN TECHNOLOGY LTD

USA . 19,192 parts In-Stock

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Lixinc

USA . 13,295 parts In-Stock

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13,295

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 6,819 parts In-Stock

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6,819

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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6,000

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Kulean Microsystems

USA . 4,152 parts In-Stock

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4,152

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 3,945 parts In-Stock

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3,945

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Futuretech Components

Singapore . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,877 parts In-Stock

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2,877

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.191

1k+ parts

$0.185

10k+ parts

$0.181

2,000

-

$0.191

$0.185

$0.181

Problanco Electronics

Mexico . 1,511 parts In-Stock

1+ parts

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1,511

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UHIMA Technologies

Türkiye . 661 parts In-Stock

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661

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Microchip USA

USA . 137 parts In-Stock

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137

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Overview

Discover the cutting-edge NCP303LSN22T1G by Onsemi, a top-quality Power Management IC designed to elevate your applications to new heights. With Onsemi's renowned expertise in power supply support circuits, this small outline, thin profile IC offers unmatched reliability and efficiency. Ideal for automotive use, this product ensures stable performance in extreme temperatures from -40°C to 125°C. Experience the value of seamless power management with the NCP303LSN22T1G, delivering precision and innovation in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the IC, ensuring long-term performance.

Surface Mount: YES

Allows for easy and convenient placement on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 1.5 V

Ideal supply voltage for various applications, providing stable power to the IC.

No. of Terminals: 5

Optimal number of terminals for connecting to other components, simplifying the circuit design.

Maximum Operating Temperature: 125 °C

Can operate efficiently in a wide range of temperatures, making it suitable for diverse environments.

Minimum Operating Temperature: -40 °C

Capable of functioning even in extremely low temperatures, ensuring reliability in harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Power Management ICs NCP303LSN22T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN22T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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