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NCP303LSN13T1

Onsemi

NCP303LSN13T1 by Onsemi

NCP303LSN13T1 by Onsemi is a Power Management IC with Vsup of 1.5V, operating temp range -40 to 125 °C, and V threshold +1.3V. Ideal for automotive applications due to its CMOS technology and compact design in small outline package.

Median Price

$0.114

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

13,500

-

$0.119

$0.099

$0.088

Verical

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

13,500

-

-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,593 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

-

1,593

$0.093

-

-

-

Vyrian

USA . 5,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,894

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,644 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

$0.088

-

-

-

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$0.089

-

-

-

Vigor

Singapore . 245 parts In-Stock

1+ parts

$0.090

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$0.090

-

-

-

AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$12.340

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$23.195

100+ parts

$21.107

1k+ parts

$19.020

10k+ parts

-

5,000

$23.195

$21.107

$19.020

-

Continental Prestige Electronics

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.089

10k+ parts

-

13,500

-

-

$0.089

-

Problanco Electronics

Mexico . 5,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,257

-

-

-

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TANS Electronics

Latvia . 2,380 parts In-Stock

1+ parts

-

100+ parts

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2,380

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-

-

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SupplyDigital Components

Austria . 1,729 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,729

-

-

-

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Kulean Microsystems

USA . 1,578 parts In-Stock

1+ parts

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100+ parts

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1,578

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Microchip USA

USA . 415 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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415

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UHIMA Technologies

Türkiye . 253 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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253

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Overview

Discover the NCP303LSN13T1 by Onsemi, a top-quality Power Management IC that offers unparalleled reliability and efficiency. Manufactured by Onsemi, a trusted leader in the industry, this product is perfect for a wide range of applications in automotive and other sectors. With its compact design and advanced technology, the NCP303LSN13T1 provides customers with exceptional performance and peace of mind. Upgrade your power supply support circuit today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The plastic/epoxy material makes the package light in weight and durable, ensuring easy handling and long-lasting performance.

Surface Mount YES

Being surface mountable, this IC can be easily installed on PCBs, saving space and enabling efficient assembly processes.

Nominal Supply Voltage (Vsup) 1.5 V

The nominal supply voltage of 1.5V ensures compatibility with a wide range of applications, making it versatile and user-friendly.

No. of Terminals 5

Having 5 terminals allows for efficient connectivity and communication within the circuit, enhancing the overall performance and reliability.

Maximum Operating Temperature 125 °C

With a high maximum operating temperature of 125 °C, this IC can withstand extreme conditions without compromising its functionality, making it suitable for various environments.

Technology CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity, resulting in improved efficiency and performance.

Technical Specifications

Power Management ICs NCP303LSN13T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 1.3V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.3V

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN13T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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