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NCP302LSN30T1

Onsemi

NCP302LSN30T1 by Onsemi

NCP302LSN30T1 by Onsemi is a Power Management IC with 5 terminals, operating b/w -40 to 125 °C. It supports supply voltages from 0.8V to 10V and has a peak reflow temp of 235 °C. Ideal for automotive applications due to its CMOS technology and small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

USA . 8,827 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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Cyclops Electronics Ltd

UK . 340 parts In-Stock

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340

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LWI Electronics Inc

India . 21 parts In-Stock

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AZTECH Wire

Italy . 401 parts In-Stock

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$11.970

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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398

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Problanco Electronics

Mexico . 6,878 parts In-Stock

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Kulean Microsystems

USA . 4,686 parts In-Stock

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TANS Electronics

Latvia . 4,681 parts In-Stock

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Corphita

USA . 1,694 parts In-Stock

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UHIMA Technologies

Türkiye . 445 parts In-Stock

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SupplyDigital Components

Austria . 432 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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Microchip USA

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Kepictronics

USA . 340 parts In-Stock

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Vigor

Singapore . 340 parts In-Stock

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Overview

Enhance your power management capabilities with the NCP302LSN30T1 by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled reliability and efficiency. Ideal for automotive applications, this small outline, thin profile package delivers a nominal supply voltage of 1.5V with a wide operating temperature range. Trust Onsemi to provide cutting-edge technology and quality products that exceed expectations. Upgrade your systems today with the NCP302LSN30T1 and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to heat and environmental factors, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Nominal Supply Voltage (Vsup): 1.5 V

The low nominal supply voltage of 1.5V makes this product energy-efficient and suitable for use in battery-powered devices.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high performance, making it ideal for power management applications.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage of 10V provides versatility in usage, allowing the product to be compatible with a wide range of power sources.

Technical Specifications

Power Management ICs NCP302LSN30T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3V

Width (mm):

1.5 mm

Trade Compliance

NCP302LSN30T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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