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NCP302HSN40T1

Onsemi

NCP302HSN40T1 by Onsemi

NCP302HSN40T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40 °C to 125°C. Ideal for power supply support circuits in compact designs.

Median Price

$0.256

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

6,000

-

$0.251

$0.208

$0.186

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.260

6,000

-

-

-

$0.260

Distributors (In-Stock)

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Digiode

USA . 1,567 parts In-Stock

1+ parts

$0.196

100+ parts

-

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-

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1,567

$0.196

-

-

-

Vyrian

USA . 8,011 parts In-Stock

1+ parts

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8,011

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,771 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

$0.074

10k+ parts

$0.074

2,771

$0.110

-

$0.074

$0.074

Corphita

USA . 1,333 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$0.185

-

-

-

Corohmni

South Africa . 77 parts In-Stock

1+ parts

$0.188

100+ parts

-

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10k+ parts

-

77

$0.188

-

-

-

Vigor

Singapore . 272 parts In-Stock

1+ parts

$0.200

100+ parts

-

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10k+ parts

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272

$0.200

-

-

-

Component Stockers USA

USA . 8,271 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

-

8,271

$0.210

$0.200

$0.180

-

AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$10.920

100+ parts

-

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450

$10.920

-

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TANS Electronics

Latvia . 8,027 parts In-Stock

1+ parts

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100+ parts

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8,027

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Kulean Microsystems

USA . 7,834 parts In-Stock

1+ parts

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7,834

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.188

10k+ parts

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6,000

-

-

$0.188

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SupplyDigital Components

Austria . 4,996 parts In-Stock

1+ parts

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4,996

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Problanco Electronics

Mexico . 2,925 parts In-Stock

1+ parts

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2,925

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UHIMA Technologies

Türkiye . 655 parts In-Stock

1+ parts

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655

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Microchip USA

USA . 183 parts In-Stock

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183

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Overview

Discover the power of the NCP302HSN40T1 from Onsemi, a high-quality Power Management IC that offers reliability and efficiency. Manufactured by Onsemi, a trusted leader in the industry, this IC is designed for a wide range of applications. With its compact design and advanced technology, this product provides customers with value, benefits, and advantages unmatched by competitors. Upgrade your power supply support circuit with the NCP302HSN40T1 and experience superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and production costs.

Nominal Supply Voltage (Vsup): 1.5 V

The specified nominal supply voltage ensures compatibility with a wide range of applications, providing stable power output.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain performance reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can operate effectively in cold environments without any performance issues.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for efficient soldering during manufacturing processes, ensuring a strong and reliable connection.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this product is suitable for use in automotive applications where temperature fluctuations are common.

Technical Specifications

Power Management ICs NCP302HSN40T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP302HSN40T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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