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NCP301LSN28T1G

Onsemi

NCP301LSN28T1G by Onsemi

NCP301LSN28T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates b/w -40 °C to 125°C. This CMOS technology IC has a matte tin finish and peak reflow temperature of 260°C.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55,865 parts In-Stock

1+ parts

-

100+ parts

$0.300

1k+ parts

$0.249

10k+ parts

$0.222

55,865

-

$0.300

$0.249

$0.222

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 620 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$0.234

-

-

-

Cyclops Electronics Ltd

UK . 17,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17,844

-

-

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Vyrian

USA . 6,150 parts In-Stock

1+ parts

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6,150

-

-

-

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Flip Electronics

USA . 3,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,300

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 55,806 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

-

10k+ parts

-

55,806

$0.209

-

-

-

Corphita

USA . 1,198 parts In-Stock

1+ parts

$0.221

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

$0.221

-

-

-

Corohmni

South Africa . 408 parts In-Stock

1+ parts

$0.246

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$0.246

-

-

-

Vigor

Singapore . 385 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$0.500

-

-

-

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$17.120

100+ parts

-

1k+ parts

-

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204

$17.120

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$21.022

100+ parts

$20.812

1k+ parts

$19.971

10k+ parts

-

50

$21.022

$20.812

$19.971

-

Metaverse IC Inc.

Canada . 146,880 parts In-Stock

1+ parts

-

100+ parts

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146,880

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Perfect Parts

USA . 30,912 parts In-Stock

1+ parts

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30,912

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Kepictronics

USA . 30,000 parts In-Stock

1+ parts

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 22,330 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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22,330

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GreenTree Electronics

Israel . 18,000 parts In-Stock

1+ parts

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18,000

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-

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iodParts Technologies Inc.

India . 6,075 parts In-Stock

1+ parts

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6,075

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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SupplyDigital Components

Austria . 2,295 parts In-Stock

1+ parts

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2,295

-

-

-

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Problanco Electronics

Mexico . 1,743 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,743

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-

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A-Z Elektronik GmbH

Germany . 1,593 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,593

-

-

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Kulean Microsystems

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

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1,447

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Futuretech Components

Singapore . 693 parts In-Stock

1+ parts

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693

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TANS Electronics

Latvia . 613 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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613

-

-

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UHIMA Technologies

Türkiye . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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450

-

-

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Microchip USA

USA . 338 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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338

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-

Overview

Experience superior power management with the NCP301LSN28T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Management ICs that are ideal for a wide range of applications. From automotive to consumer electronics, this product offers reliable performance and efficiency. With a nominal supply voltage of 1.5V and a compact package design, customers benefit from a versatile solution that meets their specific needs. Trust Onsemi to provide innovative technology that enhances your products and drives success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the Power Management IC, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5 V ensures compatibility with a wide range of electronic devices, making this Power Management IC versatile in its applications.

Temperature Grade: AUTOMOTIVE

With an automotive-grade temperature rating, this Power Management IC can withstand harsh environmental conditions typically found in automotive applications, ensuring reliable performance.

Technology: CMOS

The CMOS technology used in this Power Management IC enables low power consumption and improved efficiency, making it an energy-efficient choice for power management applications.

Technical Specifications

Power Management ICs NCP301LSN28T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.8V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301LSN28T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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