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NCP301LSN25T1

Onsemi

NCP301LSN25T1 by Onsemi

NCP301LSN25T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It has a small outline package style, operates b/w -40 °C to 125°C, and features dual terminals with tin lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,065 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Bristol Electronics

USA . 6,000 parts In-Stock

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Dan-Mar Components

USA . 6,000 parts In-Stock

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Digiode

USA . 1,426 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 133 parts In-Stock

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$17.350

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Component Stockers USA

USA . 501 parts In-Stock

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$99.990

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501

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,113 parts In-Stock

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TANS Electronics

Latvia . 5,595 parts In-Stock

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RC Electronics

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,741 parts In-Stock

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Vigor

Singapore . 860 parts In-Stock

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UHIMA Technologies

Türkiye . 396 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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Corphita

USA . 339 parts In-Stock

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Microchip USA

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Problanco Electronics

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Overview

Discover the NCP301LSN25T1 from Onsemi, a top-of-the-line Power Management IC delivering unrivaled quality and performance. With a focus on automotive applications, this compact and versatile device offers a wide supply voltage range and precise threshold voltage for optimal power supply support. Benefit from Onsemi's stellar reputation for reliability and innovation, ensuring that your projects are powered with efficiency and precision. Upgrade to the NCP301LSN25T1 today and experience the difference in your power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it a suitable choice for power management ICs.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and improving overall system reliability.

Nominal Supply Voltage (Vsup): 1.5 V

Provides a stable voltage supply for the IC to function optimally, improving its performance and longevity.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, ensuring the IC can operate in demanding environments without overheating.

Temperature Grade: AUTOMOTIVE

Designed to meet the strict automotive industry standards for temperature range and reliability, making it suitable for automotive applications.

Technical Specifications

Power Management ICs NCP301LSN25T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.5V

Width (mm):

1.5 mm

Trade Compliance

NCP301LSN25T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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